5962-8607001EA

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change vendor part number from 54F148/B2C to 54F148/B2A. Table 88-12-13 M. A. Frye I I column delete IE and substitute EI . Table I t maximum limits IL PHL6 column delete 11 and substitute 13. Add figure 4 to document. Editorial changes throughout. -ljs B Revise for QD certification. New boilerplate. -ljs 99-11-08 Raymond Monnin C Update to current requirements. Editorial changes throughout. - gap 06-01-04 Raymond Monnin The original first page of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Ray Monnin 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86070 01 E X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F148 8-line to 3-line priority encoder 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1T-16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or GDFP3-F16 16 flat package 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range .................................................................. -0.5 V dc minimum to +7.0 V dc maximum Input voltage range ..................................................................... -1.5 V at -18 mA to +7.0 V dc Storage temperature range ......................................................... -65C to +150C Maximum power dissipation (P ) 1/ .......................................... 193 mW D Lead temperature (soldering, 10 seconds) ................................. +300C Thermal resistance, junction-to-case ( ) .................................. See MIL-STD-1835 JC Junction temperature(T ) ............................................................ +175C J 1.4 Recommended operating conditions. Supply voltage range (V ) ......................................................... 4.5 V minimum to 5.5 V maximum CC Minimum high level input voltage (V ) ........................................ 2.0 V dc IH Maximum low level input voltage (V ) ......................................... 0.8 V dc IL Case operating temperature (T ) ................................................ -55C to +125C C 1/ Maximum power dissipation is defined as V x I , and must withstand the added P due to short circuit test, e.g. I CC CC D OS SIZE STANDARD 5962-86070 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97