MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features Mechanical Data Planar Die Construction Case: SOT23 350mW Power Dissipation on FR-4 PCB Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 General Purpose, Medium Current Moisture Sensitivity: Level 1 per J-STD-020 Ideally Suited for Automated Assembly Processes Terminal Connections: See Diagram Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Terminals: Matte Tin Finish annealed over Alloy 42 leadframe Halogen and Antimony Free. Green Device (Notes 3 & 4) (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.008 grams (approximate) SOT23 Top View Device Schematic Ordering Information (Notes 5 & 6) Device Qualification Packaging Shipping (Type Number)-7-F* Commercial SOT23 3000/Tape & Reel (Type Number)Q-7-F* Automotive SOT23 3000/Tape & Reel (Type Number)-13-F* Commercial SOT23 10000/Tape & Reel (Type Number)Q-13-F* Automotive SOT23 10000/Tape & Reel * Add -7-F to the appropriate type number in Electrical Characteristics Table from Page 2. Example: 6.2V Zener = MMBZ5234B-7-F. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MMBZ5221B - MMBZ5259B Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Forward Voltage I = 10mA V 0.9 V F F Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 7) P 350 mW D Thermal Resistance, Junction to Ambient Air (Note 7) 357 C/W R JA Operating and Storage Temperature Range T T -65 to +150 C J, STG Notes: 7. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at