Product Information

CSRS045V0P

CSRS045V0P electronic component of Comchip

Datasheet
ESD Suppressors / TVS Diodes LOW CAP 1.4PF 2CH 5V ESD Array

Manufacturer: Comchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.5272 ea
Line Total: USD 1.53

2823 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2672 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

Stock Image

CSRS045V0P
Comchip

1 : USD 1.1075
10 : USD 0.9246
100 : USD 0.7394
250 : USD 0.6946
500 : USD 0.6451
1000 : USD 0.5405
3000 : USD 0.5163
6000 : USD 0.5163
9000 : USD 0.4968

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Clamping Voltage
Ipp - Peak Pulse Current
Cd - Diode Capacitance
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Operating Voltage
Capacitance
Operating Temperature Range
Power Dissipation Pd
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Operating Supply Voltage
Subcategory
Taric
Vf - Forward Voltage
LoadingGif

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Low Capacitance ESD Protection Array Comchip S M D D i o d e S p e c i a l i s t CSRS045V0P-HF RoHS Device Halogen Free SOT-143 Features 0.120(3.04) 0.110(2.80) ESD Protected for 2 high speed I/O ports 0.080(2.02) 0.071(1.80) 0.038(0.96)BSC IEC61000-4-2 (ESD) 8kV (Contact) ,15kV(Air). IEC61000-4-4 (FET)(5/50ns) Level-3, 20A for I/O 0.055(1.40) 40A for Power. 0.047(1.20) IEC61000-4-5 (Lightning) 6A(8/20uS) 0.0078(0.20)BSC 0.020(0.50) Working voltage: 5V 0.014(0.35) Low capacitance:1.2pF(Typ.). Fast turn-on and Low clamping voltage. 0.043(1.10) 0.035(0.90) Mechanical data Case: SOT-143 standard package, 0.035(0.89) 0.004(0.10) 0.030(0.76) molded plastic. 0.002(0.05) Terminals: Solder plated, solderable per 0.007(0.18) MIL-STD-750,method 2026. 0.004(0.09) 0.100(2.55) Weight: 0.0108 gram(approx.). 0.089(2.25) Circuit Diagram 0.024(0.60) 0.012(0.30) 4 Dimensions in inches and (millimeters) 2 3 1 Pin Configuration VDD I/O 2 4 3 1 2 GND I/O 1 REV:B QW-JP002 Page 1 Comchip Technology CO., LTD.Low Capacitance ESD Protection Array Comchip S M D D i o d e S p e c i a l i s t Maximum Rating (at TA=25C unless otherwise noted) Symbol Parameter Value Unit Peak pulse current ( tp = 8/20 us) IPP 6 A Operating supply voltage VDC 6 V ESD per IEC 61000-4-2(Air) 17 VESD kV ESD per IEC 61000-4-2(Contact) 12 Lead soldering temperature 260 ( 10 sec) TSOL C Operating temperature Tj -55 to +85 C Storage temperature TSTG -55 to +150 C DC voltage at any I/O pin VIO (GND -0.5) to (VDD +0.5) V Electrical Characteristics (at TA=25C unless otherwise noted) Symbol Typ Parameter Conditions Min Max Unit Reverse stand-Off voltage Pin 4 to Pin 1 VRWM 5 V Reverse leakage current VRWM = 5 V, T=25C, Pin 4 to Pin 1 ILeak 2 uA ICH-Leak Channel leakage current = 5 V, VPIN 4 VPIN 1 = 0V, T=25C 1 uA Diode breakdown voltage IR = 1 mA,, T=25C, Pin 4 to Pin 1 VBV 6.2 V Forward voltage IF = 15 mA,, T=25C, Pin 1 to Pin 4 VF 0.8 1 V IPP= 5 A, tp=8/20us, T=25C, Clamping voltage VCL 8.1 9 V Any Channel Pin to Ground IEC 61000-4-2 +6kV, T=25C, ESD Holding Voltage Contact mode Any channel Vhold 13 V pin to ground Vpin4 = 5V,Vpin1= 0V, VIN=2.5V, Channel Input Capacitance pF CIN 1.2 1.4 f = 1MHz,Any channel pin to ground Vpin4 = 5V,Vpin1= 0V, VIN=2.5V Channel to Channel Input Capacitance 0.1 0.12 pF CCROSS f = 1MHz,Between channel pin Vpin4 = 5V,Vpin1= 0V, VIN=2.5V Voltage of Channel Input Capacitance f = 1MHz,Channel x pin to ground - pF CIN 0.04 0.06 channel y pin to ground REV:B QW-JP002 Page 2 Comchip Technology CO., LTD.

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS

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