AAT10

PHOTOPOSITIF ALUMINIUM PCB REF AAT10 20 August 2003 A NEW CONCEPT IN STANDARD CONSTRUCTION P.A PCB* ,s a three layered substrate. The base plate THERMAL MANAGEMENT. (usually copper or aluminum) is bonded with a polymer based, Aluminum Base, Copper Clad Substrate thermally conductive dielectric to a circuit layer (either copper or P.A PCB* is a thermal control substrate designed aluminum clad copper foil). to manage heat created by power components. P . A PCB * offers several unique features for design engineers. Components can be soldered directly to the etched copper THERMALLY Layer of P . A PCB* and they re isolated by the thermally POWER COPPER CONDUCTIVE conductive dielectric layer. Also, heat generated by power DEVICE ~ CIRCUIT LAYER (ETCHED) DIELECTRIC components is automatically transferred through this layer to LAYER the base plate of - P . A P C B * . As a result, the thermal resistance of the circuit board is significantly reduced. BASE PLATE MATERIAL: ALUMINUM TYPICAL PROPERTIES 4000 Volts min. Dielectric Strength 5-6 Dielectric Constant 1 -1 3 Watt Meter K Thermal Conductivity 9 1x10 Megohms Surface Resistivity 350C Process Temperature 180C Continuous Use Temperature THERMAL RESISTANCE Case 1 TO-220 transistor mounted to an etched pad. 4 x 5 panel size. P.A P C B * is a substrate, a heat sink and a printed circuit material. Temperature measurement junction and pane Applications include: Operating power 25 watts, DC . Replacement for heat sinks and other hardware Thermal resistance 1.0C/watt . Replacement for fragile ceramic substrates ( , junction to sink) . Replacement for printed circuit board material . Surface mount -layouts Case 2. A surface mount power transistor (MJD 3055) mounted . Custom material combinations and applications requiring to an etched pad. 1 x 3 panel size. specific thermal, dielectric and physical properties Smart power packages where power and logic are Temperature measurement - junction and panel combined 25 watts, DC Operating power 1.8 C/watt Thermal resistance ( , junction to sink) PRODUCT DATA. STANDARD CONFIGURATION Case 3. A 200 x 200 silicon die with a resistor network covering 70% of its surface is soldered directly to an etched pad. Junction temperature was sensed using diodes surrounding the resistor Circuit Layer - Copper Foil - .0014 in. printed circuit network. 4 x 5 panel size. grade - .003 in. Dielectric Temperature measurement - junction and panel Base plate - .062 in. Aluminum (alloy 6061) 20 watts, DC Operating power 1.0CJwatt Thermal resistance ( , junction to sink) * P.A PCB Photopositif Aluminium PCB. THERMAL EXPANSION PEEL STRENGTH TESTING COEFFICIENTS* cm/cmC Dielectric-Copper Foil -6 (x10) Peel Strength (Conductor width) Epoxy-Glass PCB Material.........................................10-30 Thermal Clad (Aluminum)..............................................25 10 minutes at 550F(Solder Bath)..............................7 lbs/in Thermal Clad (Copper)..................................................18 Thermal Clad (CIC)..........................................................8 Alumina(99.5%)...............................................................7 Beryllia(99.5%)................................................................8 *Approximate values OPERATING TEMPERATURE VS. POWER DISSIPATED *Transistor junction temperature tm (Data obtained using DPAK , 3055 Transistors) This table shows how transistors run cooler on Thermal Clad compared with transistors mounted on epoxy-glass printed circuit board material. 2.0 WATTS 1.0 Watts Dissipated Power Thermal Clad Epoxy-Glass (Aluminum Plate) PCB Material