Product Information

50-6-25

50-6-25 electronic component of Chemtronics

Datasheet
Desoldering Braid / Solder Removal .210"/5.3mm 25' SPOOL RED

Manufacturer: Chemtronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 30.7846 ea
Line Total: USD 30.78

32 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
35 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

50-6-25
Chemtronics

1 : USD 44.355
25 : USD 40.2505
100 : USD 39.4315

32 - WHS 2


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

50-6-25
Chemtronics

1 : USD 30.7846
5 : USD 30.3735
10 : USD 29.4515
25 : USD 28.0063
50 : USD 25.8511

     
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RoHS - XON
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CHEMTRONICS TDS SWick Technical Data Sheet Soder-Wick Desoldering Braid TYPICAL PRODUCT DATA AND PHYSICAL PRODUCT DESCRIPTION PROPERTIES Soder-Wick offers the state of the art in Flux Types: Rosin Grade WW, Type R desoldering technology. Soder-Wick is designed Patented No Clean for todays heat sensitive electronic components High Temperature No Clean using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at Specifications: ANSI/IPC J STD-004 low temperatures. Soder-Wick responds faster MIL-F-14256 F than conventional desoldering braids thereby No Clean Flux Spec: MIL-STD-883B minimizing overheating and preventing PCB Bellcore TR-NWT-000078 damage. A full range of sizes and flux types are available, including Rosin, No Clean, unfluxed and ANSI/IPC J SF818 a high temperature Lead-Free version. Whatever Shelflife: 2 years the requirement, Soder-Wick has the answer. RoHS/WEEE Requires little or no post solder cleaning No corrosive residues Status Optimized construction for faster wicking and heat transfer Width Width Halide free Size Inches Color Metric Minimizes the risk of heat damage to 1 .030 White 0.8mm components and circuit boards 2 .060 Yellow 1.5mm TYPICAL APPLICATIONS 3 .080 Green 2.0mm Soder-Wick desoldering braid safely removes solder from: 4 .110 Blue 2.8mm Thru-hole Components 5 .145 Brown 3.7mm SMT Pads and BGA Pads Micro Circuits 6 .210 Red 5.3mm Terminals BGA - Purple - Lugs and Posts STATIC DISSIPATIVE PACKAGING Identification Script Soder-Wick SD is packaged on Static Dissipative bobbins in 5 and 10-foot lengths to minimize the risk of damage associated with static electricity. The static dissipative bobbins qualify as electrostatic discharge protective per MIL-STD- 1686C and MIL-HDBK-263B, and meet the static delay rate provision of MIL-B-81705C. USAGE INSTRUCTIONS AVAILABILITY Series: For industrial use only. 40 Soder-Wick Lead-Free, SD Bobbin Read MSDS carefully prior to use. 50 Soder-Wick Rosin 1) Choose a Soder-Wick desoldering braid width 80 Soder-Wick Rosin, SD Bobbin equal to or slightly larger than the pad or 60 Soder-Wick No Clean, SD Bobbin connection. 70 Soder-Wick Unfluxed 2) Choose a solder iron tip equal to or slightly 75 Soder-Wick Unfluxed, SD Bobbin larger than the pad or connection. 3) Set temperature of iron between 600-750F VacuPak Packaging 4) Place wick on solder joint and place tip of hot The VacuPak Can contains ten five-foot bobbins iron on top of wick in a vacuum sealed can. This package provides 5) As solder becomes molten, the color of the wick the highest level of cleanliness and freshness. will change from copper to silver. Great for tool kit storage. 6) Remove wick and iron from solder joint simultaneously once color change has stopped. HELPFUL HINTS: 7) The component lead / pad is now clean and free Water Soluble Users: Use Soder-Wick from solder. Unfluxed 70 or 75 Series to dip in water soluble 8) Clip and discard the used portion of the wick. flux and then desolder normally. 9) If needed, clean PCB with CircuitWorks Flux Ball Grid Array: Use Soder-Wick BGA with a Remover Pen and remove soils with a large tipped iron to remove solder from a number of ControlWipes absorbent wipe. BGA pads all at once. SODER-WICK IS DESIGNED TO MEET NOTE: This information is believed to be accurate. It is OR EXCEED THE FOLLOWING: intended for professional end users having the skills to MIL-F-14256F, Type R evaluate and use the data properly. ITW NASA-STD-8739.3 CHEMTRONICS does not guarantee the accuracy of DOD-STD-883E, Method 2022 the data and assumes no liability in connection with ANSI/IPC J STD-004, Type ROL0 damages incurred while using it. BELLCORE TR-NWT-000078 ANSI/IPC J SF-818 Chemtronics , Soder-Wick and CircuitWorks are registered trademarks of ITW Chemtronics. All rights reserved. VacuPak and ControlWipes are trademarks of SODER-WICK SD BOBBINS ARE ITW Chemtronics. All rights reserved. DESIGNED TO MEET OR EXCEED: MIL-STD-2000A MANUFACTURED BY: MIL-B-81705C ITW Chemtronics MIL-STD-1686C MIL-HDBK-263B 8125 Cobb Center Drive Kennesaw, GA 30152 1-770-424-4888 REV. F (06/06) TECHNICAL & APPLICATION ASSISTANCE DISTRIBUTED BY: provides a technical hotline to Chemtronics answer your technical and application related questions. The toll free number is: 1-800-TECH-401.

Tariff Desc

8311.30.00 -Coated rods and cored wire, of base metal, for soldering, brazing or welding by flame

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