SRF2012-900YA

Features This series is currently available but High impedance value not recommended for new designs. Current rating up to 450 mA Recommended alternatives are the Model RoHS compliant* SRF2012A and SRF2012AA. SRF2012 Series - Common Mode Chip Inductors Electrical Specifications General Specifications Reflow soldering.....230 C 50 sec max. Impedance Rated Withstanding Insulation DCR IDC Operating Temperature ..-55 C to +125 C 100 MHz Voltage Voltage Resistance Max. Max. (Temperature rise included) Bourns Part No. ( ) Tolerance (%) (DC) (DC) (M ) () (mA) Storage Temperature..-55 C to +125 C SRF2012-300Y 30 25 50 125 10 0.20 450 Resistance to Soldering Heat SRF2012-670Y 67 25 50 125 10 0.25 400 ............................260 C, 10 sec. max. SRF2012-900Y 90 25 50 125 10 0.35 330 Materials SRF2012-121Y 120 25 50 125 10 0.30 370 Core...............................................Ferrite SRF2012-161Y 160 25 50 125 10 0.40 300 Wire.............................Enameled copper SRF2012-181Y 180 25 50 125 10 0.35 330 Terminal.....................................Ag/Ni/Sn SRF2012-201Y 200 25 50 125 10 0.35 330 Packaging...................2000 pcs. per reel SRF2012-221Y 220 25 50 125 10 0.35 310 SRF2012-261Y 260 25 50 125 10 0.40 300 Product Dimensions SRF2012-301Y 300 25 50 125 10 0.40 290 2.05 0.2 SRF2012-361Y 360 25 50 125 10 0.45 280 (.081 .008) SRF2012-371Y 370 25 50 125 10 0.45 280 SRF2012-501Y 500 25 50 125 10 0.55 170 SRF2012-671Y 670 25 50 125 10 0.60 140 1.25 0.2 SRF2012-901Y 900 25 50 125 10 0.60 80 (.049 .008) Impedance vs. Frequency 1 2 Common Mode Normal Mode CH1 Z T & B 3.5 k, 1 0.40 371 TYP. 1000 (.016) + 121 IP 670 100 4 3 0.40 0.45 0.45 181 (.016) (.018) (.018) TYP. 300 371 TYP. TYP. 261 900 261 181 10 161 121 1.25 0.2 900 (.049 .008) 670 161 300 1 0.1 1 0 100 1000 Common Mode Normal Mode Recommended Layout (f) 1 MHz 3 MHz 10 MHz 30 MHz 100 MHz 300 MHz 1 GHz 1 MHz 3 MHz 10 MHz 30 MHz 100 MHz 300 MHz 1 GHz Z 0.35 300 0.64 1.94 5.99 14.34 31.33 53.67 93.89 0.200 0.240 0.470 1.180 3.490 9.850 34.370 (.014) 670 1.45 4.42 13.62 32.45 70.17 117.65 201.20 0.250 0.290 0.550 1.340 3.830 10.560 34.260 REF. 900 1.04 3.09 10.14 28.96 90.46 254.50 491.35 0.280 0.330 0.610 1.520 4.150 11.260 38.760 121 2.64 7.96 23.80 56.67 126.11 218.67 417.23 0.330 0.380 0.670 1.640 4.710 13.030 43.460 161 1.79 5.35 17.50 49.70 153.36 327.38 574.77 0.390 0.440 0.760 1.850 5.290 14.560 53.660 0.50 171 3.87 11.68 35.09 82.74 180.25 314.98 587.53 0.400 0.450 0.750 1.800 5.050 13.770 48.810 (.020) 261 5.33 15.85 46.54 109.83 263.01 479.42 895.05 0.450 0.500 0.850 2.040 5.770 15.820 62.080 REF. 0.35 371 4.16 12.42 40.38 113.88 369.14 802.72 1135.60 0.510 0.560 0.890 2.070 5.760 15.600 72.730 0.90 0.80 (.014) (.035) (.032) REF. REF. REF. 0.90 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. (.035) Specifications are subject to change without notice. REF. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. MM DIMENSIONS: Users should verify actual device performance in their specific applications. (INCHES) OBSOLETE *RoHS COMPLIANT *RoHS COMPLIANTApplications Noise suppression Personal computers Display panels SRF2012 Series - Common Mode Chip Inductors Electrical Schematic Soldering Profile 275 N1 <1> Maximum of 10 seconds between 260C peak +255C and +260C <1> 255C 1 2 225 220C Ramp Down 4 3 190C 6C/second 60 - 90 seconds maximum 175 N2 150C 125 120 - 150 seconds 10 seconds minimum 75 Ramp Up 3C/second maximum 25 0 50 100 150 200 250 300 Time (seconds) Rev. 02/22/05 Packaging Specifications 2.0 0.5 178 (.079 .020) 16.5 (7.00) (.650) DIA. 13.0 21.0 0.8 (.512) (.827 .031) DIA. 50.0 - 0 (1.969 - 0) 13.0 DIA. (.512) 14 + 0 (.551 + 0) 4.0 4.0 START END (.157) (.157) MM DIMENSIONS: (INCHES) NO COMPONENT NO COMPONENT 200 400 COMPONENTS (7.87) (15.75) USER DIRECTION OF FEED QTY: 2000 PCS. PER REEL REV. 03/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. OBSOLETE Temperature (C)