Product Information

AXP1410

AXP1410 electronic component of Artesyn Embedded Technologies

Datasheet
Advanced TCA Shelf Features A 1/10 Gigabit Ethernet Capable Backplane

Manufacturer: Artesyn Embedded Technologies
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 12610.8158 ea
Line Total: USD 12610.82

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 1
Multiples : 1

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AXP1410
Artesyn Embedded Technologies

1 : USD 12610.8158

     
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RoHS - XON
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COMPUTING Centellis 4410, R1.0 Data Sheet AdvancedTCA 10GbE Platform Core The Artesyn Embedded Technologies Centellis 4410 AdvancedTCA platform core is specifically The Centellis 4410 is designed to address the unique carrier-grade requirements of the telecommunications industry. Artesyn Embedded Application examples include wireless infrastructure, packetized voice, wireline data, and cable Technologiess most network head-end equipment. Highly integrated and verified hardware and software components, reduced development costs and accelerating time-to-market allow network equipment providers cost-effective ATCA (NEPs) to focus their development resources on critical, differentiating features that provide a based platform core competitive advantage. High performance 10GbE ATCA The heart of the Centellis 4410 platform core is the AXP1410 AdvancedTCA (ATCA ) shelf and shelf includes redundant shelf manager and alarm modules, redundant power entry modules (PEMs) and two fan tray modules. The AXP1410 shelf features a 1/10 Gigabit Ethernet (GbE) capable 14-slot, 13U, 19 form factor backplane. The thermal characteristics of the AXP1410 shelf are an important feature - it is Best-in-class thermal and designed to meet the CP-TA B.4 thermal profile, the highest level possible. As processor power characteristics technology advances, thermal (heat dissipation) is one of the industries largest challenges - and the CP-TA B.4 compliant thermal AXP1410 meets the challenge. performance Another important element of the Centellis 4410, R1.0 platform core is the ATCA-F120 system Up to 350 watts/blade power controller and switching blade. The ATCA-F120 combines PICMG compliant base and fabric distribution interface switching functionality with two AMC slots for additional processing and/or local storage. Assuming an HA environment with redundant ATCA-F120 switch blades, combining these key 10GbE switch blades functions provides customers with two additional slots for billable applications. Simplex and duplex switch A variety of payload blades, AMCs and accessory products are available for the Centellis 4410, blade configurations available R1.0 platform core depending on application requirements. Proven 10GbE switch blade integration Combined switch/control blades to maximize billable application slots Integrated software environment including operating system Platform core compliance RoHS (6 of 6) compliant Designed for NEBS/ETSI complianceCentellis 4410, R1.0 Data Sheet Block Diagram Switch / Control Blades Backplane Payload Blades Fabric Fabric AMC2 Processor RTM Base Base & Fabric RTM Extension Base IPMB AMC1 IPMC IPMB Fabric NPU RTM Base IPMB IPMB Shelf Manager Update Channel Shelf Manager IPMB Fabric DSP RTM Base IPMB IPMC IPMB AMC2 Base & Fabric RTM Fabric Base Extension Custom RTM Base AMC1 Fabric IPMB 2 I C Direct connections 3.0 Base 3.1 Fabric application development or other activities to create competitive Platform Architecture product features. The Centellis 4410 platform core integrates The Centellis 4410 platform core was designed to provide a industry standards, hardware and software components and common platform on which multiple 1 and 10 Gigabit Ethernet verifies them to create an operational platform ready for customer applications can be deployed. In order to leverage the platform application development. across a wide range of applications, a standards-based approach was essential and deployed at all levels of design. PICMG 3.0 Chassis/mechanical form factor and power/cooling AXP1410 Shelf Overview design The AXP1410 shelf includes all the components required to create PICMG 3.1 High performance fabric interface capable of 1 and a complete, redundant ATCA platform. Redundant shelf manager 10Gbps operation and alarm modules, redundant power entry modules and an N+1 OSDL CGL OSDL compliant Carrier Grade Linux distribution cooling architecture via two tray modules are all included. The shelf SA Forum Standard interface support at the hardware level form factor allows for three complete AXP1410 shelves configured (HPI) and HPI to ATCA mapping in a standard 42U telecom rack with several U slots available for breaker panels and management elements. Some of the salient The availability of industry standards for hardware and software features/functions of the AXP1410 shelf include: components clearly paves the way for overall platform cost reduction, freedom of choice and resource preservation. However, Multiple fabric bandwidth options 1 and 10 GbE to provide a true open platform requires the integration and Designed for CP-TA B.4 thermal compliance verification of these components into a system for which a tele- Excellent cable management communications vendor can simply port their application. This Power distribution up to 350 watts per slot critical integration and verification activity represents significant time and resources that could otherwise be devoted to higher level

Tariff Desc

3926.90.90 Other articles of plastics and articles of other materials ---Other

4811.41.10 Goods, as follows:
(a) in rolls or strips of a width not exceeding 15 cm;
(b) in rectangular (including square) sheets in which no side exceeds 36 cm, in the unfolded state;
(c) in rectangular sheets with one side exceeding 36 cm and the other side not exceeding 15 cm, in the unfolded state:

4821.90.00 TC 1206403 LABELS, thermal transfer, self adhesive, having ALL of the
following:
(a) paper layer;
(b) metal carrier layer;
(c) adhesive layer;
(d) heat resistance to 350 degrees C
Artesyn Embedded Power
ARTESYN TECHNOLOGIES
Emerson / Artesyn Technologies
Emerson Network Power
EMERSON NETWORK PWR
EMERSON?NETWORK POWER

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