Model BD2425N100ATI Rev A Impedance Matched Ultra Low profile 0404 Balun for TI CC2530 chipset (Anaren Application Note Ann-2004) Description The BD2425N100ATI is a low cost, low profile sub-miniature unbalanced to balanced transformer specifically designed for differential inputs and output locations Texas Instruments CC2530 SoC Solution in an easy to use surface mount package. The BD2425N100ATI is ideal for high volume manufacturing and delivers higher performance than traditional ceramic baluns. This transformation enables single ended signals to be applied to differential ports on the CC2530. The output ports have equal amplitude (- 3dB) with 180 degree phase differential. The BD2425N100ATI is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: ROOM (25C) 2400 2500 MHz Parameter Min. Typ. Max Unit Matched to TI CC2530 SoC Frequency 2300 2600 MHz 0.57mm Height Profile Low Insertion Loss Unbalanced Port Impedance* 50 Surface Mountable Balanced Port Impedance* Matched Tape & Reel Return Loss* 17.3 23.6 dB Non-conductive Top Surface Insertion Loss** 0.68 0.84 dB RoHS Compliant Power Handling 1.0 Watts Zigbee, RF4CE Halogen Free Operating Temperature -55 +85 C *Specification based on performance of unit properly installed on microstrip printed circuit boards with 50 nominal impedance. ** Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1dB higher at +85C Outline Drawing Top View (Near-side) Side View Bottom View (Far-side) .24 3x .27 .05 .57 .10 1.04 1 2 .24 3x .27 .30 1.04.10 .30 .50 3x .25 3 4 3x .25 .50 Pin Designation GND / DC Feed 1 + RF GND 2 Unbalanced Port 3 Balanced Port Dimensions are in Millimeters 4 Balanced Port Mechanical Outline USA/Canada: (315) 432-8909 Visit us at Toll Free: (800) 411-6596 Europe: +44 2392-232392 www.Anaren.com Asia: +86 512-62749282 Mode l BD2425N100ATI Rev A Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from organic PTFE based composites which possess excellent electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier. An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. Circuit Pattern Plated thru Footprint Pad (s) hole to ground Solder Resist 0402 .33 3x .29 Capacitor 3x .29 .50 .22 .22 .50 Transmission Line 3x 0402 Inductor Dimensions are in Millimeters Mounting Footprint USA/Canada: (315) 432-8909 Visit us at Toll Free: (800) 411-6596 Europe: +44 2392-232392 www.Anaren.com Asia: +86 512-62749282