MAX8819A/MAX8819B/MAX8819C 19-4166 Rev 1 4/09 PMIC with Integrated Chargers and Smart Power Selector in a 4mm x 4mm TQFN General Description Features The MAX8819 is a complete power solution for MP3 Smart Power Selector players and other handheld applications. The IC Operates with No Battery Present includes a battery charger, step-down converters, and USB/AC Adapter One-Cell Li+ Charger WLED power. It features an input current-limit switch to Three 2MHz Step-Down Converters power the IC from an AC-to-DC adapter or USB port, a 95% Peak Efficiency 1-cell lithium ion (Li+) or lithium polymer (Li-Poly) charg- 100% Duty Cycle er, three step-down converters, and a step-up converter 3% Output Accuracy over Load/Line/ with serial step dimming for powering two to six white Temperature LEDs. All power switches for charging and switching the 2 to 6 Series WLED Driver with Dimming Control system load between battery and external power are included on-chip. No external MOSFETs are required. Active-Low REG1 Reset Output The MAX8819C offers a sequenced power-up/power- Short-Circuit/Thermal-Overload/Input down of OUT1, OUT2, and then OUT3. Undervoltage/Overvoltage Protection Maxims Smart Power Selector makes the best use of Power-Up/Down Sequencing (MAX8819C) AC-to-DC adapter power or limited USB power. Battery 2 Total Solution Size: Less Than 90mm charge current and input current limit are independent- ly set. Input power not used by the system charges the battery. Charge current is resistor programmable and Typical Operating Circuit the input current limit can be selected as 100mA, 500mA, or 1A. Automatic input selection switches the system load from battery to external power. In addition, USB/AC-TO-DC on-chip thermal limiting reduces the battery charge rate ADAPTER to prevent charger overheating. SYS DC Applications DLIM1 DLIM2 MP3 Players BAT Portable GPS Devices + Li+/Li-Poly ENABLE SYSTEM EN123 BATTERY Low-Power Handheld Products Cellular Telephones ENABLE CHARGER CEN OUT1 Digital Cameras LX1 I/O ENABLE BACKLIGHT EN4 Handheld Instrumentation MAX8819 SYS LX4 PDAs OVP4 OUT2 LX2 MEMORY Ordering Information SYS OUT3 PIN- LX3 PART TEMP RANGE VOLTAGE CORE PACKAGE (V) MAX8819AETI+ -40C to +85C 28 TQFN-EP* 4.35 CISET MAX8819BETI+ -40C to +85C 28 TQFN-EP* 5.3 CHG CHG FB4 MAX8819CETI+ -40C to +85C 28 TQFN-EP* 4.35 RST1 RST1 +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Smart Power Selector is a trademark of Maxim Integrated Products, Inc. Pin Configuration appears at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLEPMIC with Integrated Chargers and Smart Power Selector in a 4mm x 4mm TQFN ABSOLUTE MAXIMUM RATINGS DC, SYS, BAT, CISET, DLIM1, DLIM2, EN123 Continuous Power Dissipation (T = +70C) A CEN, EN4, CHG, RST1, FB1, FB2, FB3 to GND....-0.3V to +6V 28-Pin Thin QFN Single-Layer Board (derate 20.8mW/C PV2 to GND...............................................-0.3V to (V + 0.3V) above +70C)...........................................................1666.7mW SYS PV13 to SYS...........................................................-0.3V to +0.3V 28-Pin Thin QFN Multilayer Board (derate 28.6mW/C PG1, PG2, PG3, PG4 to GND................................-0.3V to +0.3V above +70C)...........................................................2285.7mW COMP4, FB4 to GND ................................-0.3V to (V + 0.3V) Junction-to-Case Thermal Resistance ( ) (Note 2) SYS JC LX4 to PG4 .............................................................-0.3V to +33V 28-Lead Thin QFN...........................................................3C/W OVP4 to GND .........................................................-0.3V to +33V Operating Temperature Range ...........................-40C to +85C LX1, LX2, LX3 Continuous Current (Note 1) .........................1.5A Junction Temperature........................................-40C to +125C LX4 Current ................................................................750mA Storage Temperature.........................................-65C to +150C RMS Output Short-Circuit Duration.....................................Continuous Lead Temperature (soldering, 10s) .................................+300C Note 1: LX1, LX2, LX3 have clamp diodes to their respective PG and PV . Applications that forward bias these diodes must take care not to exceed the package power dissipation limits. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to