EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX17491 Single-Phase Synchronous MOSFET Driver General Description Features The MAX17491 is a single-phase synchronous nonin- Single-Phase Synchronous MOSFET Driver verting MOSFET driver. The MAX17491 is intended to 0.5 Low-Side On-Resistance work with controller ICs like the MAX8736, MAX8786, or 0.7 High-Side On-Resistance MAX17030 in multiphase notebook CPU core regulators. 10ns Minimum Guaranteed Dead Time The regulators can either step down directly from the battery voltage to create the core voltage or step down Integrated Boost Diode from the main system supply. The single-stage conver- 2V to 24V Input Voltage Range sion method allows the highest possible efficiency, while Selectable Pulse-Skipping Mode the 2-stage conversion at higher switching frequency Low-Profile, 3mm x 3mm, TQFN Package provides the minimum possible physical size. The low-side driver is optimized to drive 3nF capacitive Typical Operating Circuit loads with 4ns/8ns typical fall/rise times, and the high- side driver with 8ns/10ns typical fall/rise times. Adaptive dead-time control prevents shoot-through currents and INPUT (V ) IN 5V TO 24V maximizes converter efficiency. The MAX17491 features improved zero crossing and UVLO performance over the MAX8791/MAX8791B. PWM DH The MAX17491 is available in a small, lead-free, 8-pin, 3mm x 3mm TQFN package. BST SKIP PWM SKIP Applications V (1.45V OUT MAX17491 AT 20A) Notebooks/Desktops/Servers LX CPU Core Power Supplies Multiphase Step-Down Converters +5V BIAS V DD SUPPLY DL Ordering Information appears at end of data sheet. GND PAD 19-5324 Rev 1 1/20MAX17491 Single-Phase Synchronous MOSFET Driver Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V Continuous Power Dissipation DD SKIP to GND ...........................................................-0.3V to +6V 8-Pin 3mm x 3mm TQFN PWM to GND ...........................................................-0.3V to +6V (derate 14.4mW/C above +70C) ............................1150mW DL to GND ................................................ -0.3V to (V + 0.3V) Operating Temperature Range ......................... -40C to +105C DD BST to GND ..........................................................-0.3V to +36V Junction Temperature ......................................................+150C DH to LX ..................................................-0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C BST BST to V ...........................................................-0.3V to +30V Lead Temperature (soldering, 10s) .................................+300C DD BST to LX ................................................................-0.3V to +6V Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 8 TQFN-EP Package Code TQ833+1 Outline Number 21-0136 Land Pattern Number 90-0066 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 69.54C/W* JA Junction to Case ( ) 17.96C/W JC *Based on JEDEC51-7 For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (Circuit of Figure 1, V = V = 5V, T = -40C to +105C, unless otherwise noted. Typical values are at T = +25C.) (Note 1) DD SKIP A A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage Range V 4.20 5.50 V DD Rising edge, PWM disabled below this level 3.7 4.05 V Undervoltage- DD V V UVLO(VDD) Lockout Threshold Falling edge, PWM disabled below this level 3.30 3.40 3.75 PWM = open after the shutdown hold time has 0.08 0.20 expired Quiescent Supply Current SKIP = GND, PWM = GND, LX = GND I mA DD (V ) (after zero crossing) this state should be equivalent 0.15 0.30 DD to low-power standby if LX = GND SKIP = GND or V , PWM = V , V = 5V 0.35 0.70 DD DD BST DRIVERS t Minimum on-time 50 ON(MIN) PWM Pulse Width ns Minimum off-time required to allow the zero-crossing t 300 OFF(MIN) comparator time to settle to the proper state DL Propagation Delay t PWM high-to-DL low 15 ns PWM-DL Maxim Integrated 2 www.maximintegrated.com