EVALUATION KIT AVAILABLE MAX14611 Quad Bidirectional Low-Voltage Logic-Level Translator General Description Benefits and Features The MAX14611 is a quad bidirectional logic-level transla- S Improved Interoperability 2 tor that provides the level shifting necessary to allow data Meets I C Specifications transfer in a multivoltage system. Externally applied volt- 10kI Internal Pullup Resistor ages, V and V , set the logic levels on either side of Pin-to-Pin Compatible with the MAX3377E and CC L the device. A low-voltage logic signal present on the V the MAX3378E L side of the device appears as a high-voltage logic signal 0.9V Operation on Low Voltage Supply on the V side of the device, and vice-versa. CC S Robust Logic-Level Translation 2 The device is ideal for I C bus as well as MDIO bus appli- 0.5V Tolerances on All Pins cations where open-drain operation is often required. The 6kV Human Body Model ESD Protection on device features a three-state output mode (TS). Drive TS I/OVCC Lines high to connect the pullup to the powered I/O port. This Thermal Short-Circuit Protection 2 allows for continuous, undisrupted I C operation on the Short to Ground Fault Protection on All Pins powered side of the device while the level translation -40NC to +85NC Operating Temperature Range function is off. The MAX14611 is a pin-to-pin compatible S Increased Design Flexibility upgrade to the MAX3378E in the TDFN package. Ultra-Low Supply Current The MAX14611 features enhanced high-electrostatic- Pullup Resistor Enabled with a Single Power discharge (ESD) protection on all I/OVCC ports up to Supply when TS = High 6kV HBM. The device operates over the -40NC to +85NC 10I (max) Transmission Gate FET extended temperature range and is available in 3mm x Small, 14-Pin, 3.0mm x 3.0mm TDFN Package 3mm, 14-pin TDFN and 4.9mm x 5.1mm, 14-pin TSSOP and 14-Pin, 4.9mm x 5.1mm TSSOP Package packages. Applications Ordering Information appears at end of data sheet. 2 SPI, I C, and MDIO Mobile Phones Level Translation POS Systems Low-Voltage ASIC Telecommunications Level Translation Equipment Portable Electronics Typical Operating Circuit +1.8V +3.3V 0.1F 1F V V L CC TS +1.8V SYSTEM +3.3V MAX14611 CONTROLLER SYSTEM DATA I/OVL I/OVCC DATA For related parts and recommended products to use with this part, refer to www.maximintegrated.com/MAX14611.related. For pricing, delivery, and ordering information, please contact Maxim Direct at 19-6276 Rev 0 4/12 1-888-629-4642, or visit Maxim Integrateds website at www.maximintegrated.com.MAX14611 Quad Bidirectional Low-Voltage Logic-Level Translator ABSOLUTE MAXIMUM RATINGS (All voltages referenced to GND.) Continuous Power Dissipation (T = +70NC) A TDFN (derate 24.4mW/NC above +70NC) ...............1951.2mW V ..........................................................................-0.5V to +6V CC TSSOP (derate 10mW/NC above +70NC) .................796.8mW V ..........................................................................-0.5V to +5.5V L Operating Temperature Range .......................... -40NC to +85NC TS ............................................................................-0.5V to +6V Maximum Junction Temperature .....................................+150NC I/OVCC .................................................... -0.5V to (V + 0.5V) CC Storage Temperature Range ............................ -65NC to +150NC I/OVL .......................................................... -0.5V to (V + 0.5V) L Lead Temperature (soldering, 10s) ................................+300NC Short-Circuit Duration I/OVL , I/OVCC to GND .......Continuous Soldering Temperature (reflow) .....................................+260NC Continuous Current .........................................................Q50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TSSOP TDFN-EP Junction-to-Ambient Thermal Resistance (q ) ......100.4C/W Junction-to-Ambient Thermal Resistance (q ) ...........41C/W JA JA Junction-to-Case Thermal Resistance (q ) ................30C/W Junction-to-Case Thermal Resistance (q ) ..................8C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = +1.65V to +5.5V, V = 0.9V to the lesser of V + 0.3V and 5V. T = T = -40NC to +85NC, unless otherwise noted. Typical CC L CC A J values are at V = +3.3V, V = +1.8V, T = +25NC, unless otherwise noted.) (Notes 2, 3) CC L A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES V Supply Range V 0.9 5 V L L V Supply Range V 1.65 5.5 V CC CC V Supply Current I 1 FA I/OVCC = V , I/OVL = V ,TS = V L VL CC L L V Supply Current I I/OVCC = V , I/OVL = V ,TS = V 35 FA CC VCC CC L L 0.1 1 TS = GND, I/OVCC = unconnected V Shutdown Mode Supply CC I FA SHDN VCC TS = V , V = GND, CC L Current 0.1 1 I/OVCC = unconnected 0.1 1 TS = GND V Shutdown Mode Supply L I FA SHDN VL TS = V , V = GND, L CC Current 0.1 1 I/OVL = unconnected I/OVCC , I/OVL , TS Leakage I 0.1 1 FA T = +25NC, TS = GND LEAK A Current I T = +25NC 1 FA TS Input Leakage Current LEAK TS A V Shutdown Threshold V 0.3 0.85 V L TH VL V Shutdown Threshold V 0.8 1.35 V CC TH VCC I/OVL Pullup Resistor R 10 kI VL PU I/OVCC Pullup Resistor R 10 kI VCC PU Maxim Integrated 2