Product Information

MAX13055EETI+

MAX13055EETI+ electronic component of Analog Devices

Datasheet
Translation - Voltage Levels 1.62V to 3.6V, 8-Channel, High-Speed LLT

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 13.608 ea
Line Total: USD 13.61

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 55
Multiples : 1

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MAX13055EETI+
Analog Devices

55 : USD 5.3547
60 : USD 5.0679
120 : USD 4.9952
280 : USD 4.9226
550 : USD 4.8499
2800 : USD 4.7772
5500 : USD 4.7046

0 - WHS 2


Ships to you between Wed. 29 May to Fri. 31 May

MOQ : 1
Multiples : 1

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MAX13055EETI+
Analog Devices

1 : USD 13.608
10 : USD 11.856
25 : USD 11.31
110 : USD 9.425
275 : USD 9
550 : USD 8.2125
1045 : USD 7.9375
2530 : USD 7.675

     
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MAX13055EMAX13058E 19-4813 Rev 0 7/09 1.62V to 3.6V, 8-Channel, High-Speed LLT General Description Features The MAX13055EMAX13058E 8-channel, bidirectional Compatible with 4mA Input Drivers or Larger level translators provide the level shifting necessary for 100Mbps Guaranteed Data Rate 100Mbps data transfer in multivoltage systems. The MAX13055EMAX13058E are ideal for level translation 8 Bidirectional Channels in systems with 8 channels. Externally applied voltages, +1.62V V +3.2V and +2.2V V +3.6V L CC V and V , set the logic levels on either side of the CC L device. Logic-high signals presented on the V side of Supply Voltage Range L the device appear as a logic-high signal on the V CC 24-Bump WLP (0.4mm Pitch) Lead-Free Package side of the device and vice versa. 28-Pin TQFN (3.5mm x 5.5mm) Lead-Free Package The MAX13055EMAX13058E operate at full speed with external drivers that source as little as 4mA output Extended ESD Protection on I/O V Lines CC current or larger. Each input/output (I/O) channel is 15kV per Human Body Model pulled up to V or V by an internal 40A current CC L 15kV IEC 61000-4-2 Air Discharge source, allowing the MAX13055EMAX13058E to be 8kV IEC 61000-4-2 Contact Discharge driven by either push-pull or open-drain drivers. The MAX13055EMAX13058E feature an enable (EN) input to place the device into a low-power shutdown Typical Operating Circuit mode when driven low. In addition, the MAX13055E MAX13058E feature an automatic shutdown mode that +3.3V +1.8V disables the part when V is less than V . Each CC L device has a different I/O V and I/O V state during L CC shutdown mode (see the Ordering Information/Selector 0.1F 0.1F 1F Guide). The MAX13055EMAX13058E operate with V voltages CC V V L CC from +2.2V to +3.6V and V voltages from +1.62V to +1.8V L +3.3V SYSTEM +3.2V, making them ideal for data transfer between low- SYSTEM MAX13055E CONTROLLER voltage ASIC/PLDs and higher voltage systems. The MAX13058E MAX13055EMAX13058E are available in 0.4mm pitch, EN EN 24-bump WLP and 28-pin TQFN (3.5mm x 5.5mm) pack- DATA I/O V I/O V DATA L CC ages. The MAX13055EMAX13058E operate over the 8 8 GND GND GND extended -40C to +85C temperature range. Applications Low-Voltage ASIC Level Portable Communication Translation Devices Pin Configurations appear at end of data sheet. Smart Card Readers Cell Phones Camera Modules GPS Portable POS Systems Telecomm Equipment Ordering Information/Selector Guide I/O V STATE I/O V STATE L CC PART TEMP RANGE PIN-PACKAGE DURING SHUTDOWN DURING SHUTDOWN MAX13055EEWG+ Open Drain Open Drain -40C to +85C 24 WLP 28 TQFN-EP* MAX13055EETI+ Open Drain Open Drain -40C to +85C Ordering Information/Selector Guide continued at end of data sheet. +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com. EVALUATION KIT AVAILABLE1.62V to 3.6V, 8-Channel, High-Speed LLT ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) Junction-to-Case Thermal Resistance ( ) (Note 1) JC V , V -0.3V to +4.0V 28-Pin TQFN................................................................2.7C/W CC L ............................................................................. EN..........................................................................-0.3V to +4.0V Junction-to-Ambient Thermal Resistance ( ) (Note 1) JA I/O V .....................................................-0.3V to (V + 0.3V) 24-Bump WLP ..............................................................97C/W CC CC I/O V ...........................................................-0.3V to (V + 0.3V) 28-Pin TQFN.................................................................35C/W L L Short-Circuit Duration Operating Temperature Range ...........................-40C to +85C I/O to GND..................................................................Continuous Junction Temperature......................................................+150C Continuous Power Dissipation (T = +70C) Storage Temperature Range .............................-65C to +150C A 28-Pin TQFN (derate 28.6mW/C above +70C) .......2286mW Lead Temperature (soldering, 10s) .................................+300C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +2.2V to +3.6V, V = +1.62V to +3.2V, EN = V , T = -40C to +85C, unless otherwise noted. Typical values are at V = +3.3V, CC L L A CC V = +1.8V, and T = +25C.) (Notes 2, 3) L A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS V Supply Range V 1.62 3.2 V L L V Supply Range V 2.2 3.6 V CC CC Supply Current from V I I/O V = V , I/O V = V 40 A CC QVCC CC CC L L Supply Current from V I I/O V = V , I/O V = V 10 A L QVL CC CC L L V Shutdown Supply Current I T = +25C, EN = GND 0.1 2 A CC SHDN-VCC A T = +25C, EN = GND 0.1 1 V Shutdown Mode Supply A L I A SHDN-VL Current T = +25C, EN = V , V = 0V 0.1 4 A L CC I/O Three-State Leakage Current I T = +25C, EN = GND 0.1 2 A LEAK A o E N Input Lea kage C ur r ent I T = +25C1A LEAK EN A V - V S hutdow n Th res hold H i g hV V rising 0 0.1 x V 0.8 V L CC TH H CC L V - V S hutdow n Th res hold Low V V falling 0 0.12 x V 0.8 V L CC TH L CC L I/O V Pulldown Resistance CC R MAX13056E/MAX13058E 10 16.5 23 k VCC PD SD During Shutdown I/O V Pulldown Resistance L R MAX13057E/MAX13058E 10 16.5 23 k VL PD SD During Shutdown I/O V Pullup Current L I I/O V = GND, I/O V = GND 20 65 A VL PU L CC (Normal Mode) I/O V Pullup Current CC I I/O V = GND, I/O V = GND 20 65 A VCC PU CC L (Normal Mode) I/O V to I/O V DC Resis tance R 3k L C C IOVL IOVCC ESD PROTECTION All P ort s Human Body Model + 2kV Human Body Model + 15 I/O V Only IEC 61000-4- 2 A ir - Gap Di sc harg e, C = 1F + 15 kV C C V C C IEC 61000-4- 2 C ontact Disc harg e, C = 1F + 8 V C C 2 MAX13055EMAX13058E

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Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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