Product Information

HMC8325-SX

HMC8325-SX electronic component of Analog Devices

Datasheet
RF Amplifier E-Band Low Noise Amplifier 71 to 86 GHz

Manufacturer: Analog Devices
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2: USD 205.9959 ea
Line Total: USD 411.99

0 - Global Stock
MOQ: 2  Multiples: 2
Pack Size: 2
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0 - Global Stock


Ships to you between Fri. 10 May to Tue. 14 May

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HMC8325-SX
Analog Devices

2 : USD 218.1981
10 : USD 217.4469

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Technology
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Minimum Operating Temperature
Maximum Operating Temperature
Operating Supply Current
Packaging
Series
Test Frequency
Brand
Number Of Channels
Input Return Loss
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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71 GHz to 86 GHz, E-Band Low Noise Amplifier Data Sheet HMC8325 FEATURES GENERAL DESCRIPTION Gain: 21 dB typical The HMC8325 is an integrated E-band gallium arsenide (GaAs), Noise figure: 3.6 dB typical monolithic microwave integrated circuit (MMIC), low noise Output power for 1 dB compression: 13 dBm typical amplifier (LNA) chip that operates from 71 GHz to 86 GHz. Input third-order intercept at maximum gain: 1 dBm typical The HMC8325 provides 21 dB of gain, 13 dBm of output P1dB, Output third-order intercept at maximum gain: 22 dBm typical 22 dBm of OIP3, and 17 dBm of P while requiring only 50 mA SAT Saturated output power: 17 dBm typical from a 3 V power supply. The HMC8325 exhibits excellent linearity Input return loss: 15 dB typical and is optimized for E-band communications and high capacity, Output return loss: 17 dB typical wireless backhaul radio systems. All data is taken with the chip Die size: 2.844 mm 0.999 mm 0.05 mm in a 50 test fixture connected via a 3 mil wide 0.5 mil thick 7 mil long ribbon on each port. APPLICATIONS E-band communication systems High capacity wireless backhauls Test and measurement FUNCTIONAL BLOCK DIAGRAM V V V V V V V V G1 D1 G2 D2 G3 D3 G4 D4 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 3 21 RF 2 RF IN OUT 1 22 HMC8325 Figure 1. Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 2017 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com 14692-001HMC8325 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................6 Applications ....................................................................................... 1 Theory of Operation ...................................................................... 12 General Description ......................................................................... 1 Application Information ................................................................ 13 Functional Block Diagram .............................................................. 1 Mounting and Bonding Techniques for Millimeterwave GaAs MMICs ......................................................................................... 14 Revision History ............................................................................... 2 Handling Precautions ................................................................ 14 Specifications ..................................................................................... 3 Mounting ..................................................................................... 14 Absolute Maximum Ratings ............................................................ 4 Wire Bonding .............................................................................. 14 Thermal Resistance ...................................................................... 4 Assembly Diagram ..................................................................... 15 ESD Caution .................................................................................. 4 Outline Dimensions ....................................................................... 16 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 16 Interface Schematics..................................................................... 5 REVISION HISTORY 2/2017Revision 0: Initial Version Rev. 0 Page 2 of 16

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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