TH-10-300X300X0.1MM

TH Series 2.5W/mk Thermally Conductive adhesive tapes The TH Series of thermally conductive adhesive tapes possess extremely high 2.5W/mk Thermal Conductivity and low thermal impedance and yet maintain a high bonding strength. The tape can be used to replace thermal filler pads, thermal grease with mechanical fixings. Applications include bonding Heat Sinks, Microprocessors, LED s, and other high power semiconductors. Features Application Thermal Conductivity 2.5 W/m-k Mounting heatsinks on BGA processor High bond strength to a variety or drive processor. of surfaces. Mounting heat spreader onto PCB or Double sided pressure sensitive onto motor control PCB adhesive tape. Can be used instead of heat cure High performance thermally adhesive, screw mounting or clip conductive acrylic adhesive. mounting. Contact us for alternative thickness. Standard roll Size: 1030mm x 30m - individual die cut shapes can be supplied Can be provided with fiberglass reinforcement www.amecthermasol.co.uk Test Data Anti-aging properties Long term temperature changes under shear stress test Test conditions: bonding material for aluminium, take sample of high temperature aging test The sample area of 1 square inch adhesive Heating time before test Test method: According to UL-746C test, high temperature aging conditions (100C, a continuous 1000 hours) shear To last at least 50% of requirements www.amecthermasol.co.uk