Product Information

MT48LC2M32B2TG-6A:J

MT48LC2M32B2TG-6A:J electronic component of Alliance Memory

Datasheet
DRAM SDRAM 64M 2M X 32 TSOP C TEMP , LEADED
Manufacturer: Alliance Memory
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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N/A

Obsolete

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0 - WHS 1

MOQ : 1
Multiples : 1

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MT48LC2M32B2TG-6A:J
Alliance Memory

1 : USD 1.7464
10 : USD 1.5939
25 : USD 1.5523
50 : USD 1.5385
100 : USD 1.386
250 : USD 1.3721
500 : USD 1.3583
1000 : USD 1.3028
2000 : USD 1.1989
N/A

Obsolete

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Additional Infomation About Product

64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 512K x 32 x 4 Banks Options Marking Features Configuration PC100-compliant 2 Meg x 32 (512K x 32 x 4 banks) 2M32B2 Fully synchronous all signals registered on positive 1 Plastic package OCPL edge of system clock 86-pin TSOP II (400 mil) standard TG Internal pipelined operation column address can 86-pin TSOP II (400 mil) Pb-free P be changed every clock cycle 90-ball VFBGA (8mm x 13mm) Pb- B5 Internal banks for hiding row access/precharge free Programmable burst lengths: 1, 2, 4, 8, or full page Timing cycle time Auto precharge, includes concurrent auto precharge 5ns (200 MHz) -5 and auto refresh modes 2 5.5ns (183 MHz) -55 Self refresh mode (not available on AT devices) 3 6ns (167 MHz) -6A Auto refresh 2 6ns (167 MHz) -6 64ms, 4096-cycle refresh 2 7ns (143 MHz) -7 (commercial and industrial) Operating temperature range 16ms, 4096-cycle refresh Commercial (0C to +70C) None (automotive) Industrial (40C to +85C) IT LVTTL-compatible inputs and outputs 4 Automotive (40C to +105C) AT Single 3.3V 0.3V power supply Revision :G/:J Supports CAS latency (CL) of 1, 2, and 3 1. Off-center parting line. Notes: 2. Available only on revision G. 3. Available only on revision J. 4. Contact Micron for availability. Table 1: Key Timing Parameters CL = CAS (READ) latency Clock t t t t Speed Grade Frequency (MHz) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) -5 200 3-3-3 15 15 15 -55 183 3-3-3 16.5 16.5 16.5 -6A 167 3-3-3 18 18 18 -6 167 3-3-3 18 18 18 -7 143 3-3-3 20 20 21 PDF: 09005aef811ce1fe Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 64mb x32 sdram.pdf - Rev. V 09/14 EN 1999 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.64Mb: x32 SDRAM Features Table 2: Address Table Parameter 2 Meg x 32 Configuration 512K x 32 x 4 banks Refresh count 4K Row addressing 2K A 10:0 Bank addressing 4 BA 1:0 Column addressing 256 A 7:0 Table 3: 64Mb (x32) SDR Part Numbering Part Numbers Architecture Package MT48LC2M32B2TG 2 Meg x 32 86-pin TSOP II MT48LC2M32B2P 2 Meg x 32 86-pin TSOP II 1 MT48LC2M32B2B5 2 Meg x 32 90-ball VFBGA Note: 1. FBGA Device Decoder: www.micron.com/decoder. PDF: 09005aef811ce1fe Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 64mb x32 sdram.pdf - Rev. V 09/14 EN 1999 Micron Technology, Inc. All rights reserved.

HS Compliance

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:

Alliance Memory may also be referenced as

ACM
ALLIANCE MEMORY, INC.
ALLIANCE SEMI

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