Product Information

ASFC4G31M-51BIN

ASFC4G31M-51BIN electronic component of Alliance Memory

Datasheet
eMMC 4GB 32GB X 1 NAND - 3V - 153 Ball FBGA
Manufacturer: Alliance Memory
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.1711 ea
Line Total: USD 10.17

8307 - Global Stock
Ships to you between
Fri. 10 May to Tue. 14 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
1957 - Warehouse 1


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1

Stock Image

ASFC4G31M-51BIN
Alliance Memory

1 : USD 7.1185
10 : USD 6.44
100 : USD 5.8995
250 : USD 5.75
480 : USD 5.474
1120 : USD 5.359
5120 : USD 5.083
10080 : USD 5.083

Read More Specifications

     
Manufacturer
Product Category
Memory Size
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
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Additional Infomation About Product

ASFC4G31M-51BIN Revision History 4GB eMMC 153ball FBGA PACKAGE Revision Details Date Rev 1.0 Initial Release Dec. 2021 Confidential -139- Rev.1.0 December 2021ASFC4G31M-51BIN CONTENTS 1 Product Overview ............................................................................................................................................ 5 1.1 Product Description .................................................................................................................................................... 5 1.2 Product Ordering Information .................................................................................................................................. 5 1.3 Key Features ................................................................................................................................................................ 6 2 Package Information ........................................................................................................................................ 7 2.1 Package Dimension ..................................................................................................................................................... 7 2.2 Ball & Signal Assignment ............................................................................................................................................. 8 2.3 Product Architecture ................................................................................................................................................. 10 3 Technical Notes .............................................................................................................................................. 11 3.1 HS400 Interface ......................................................................................................................................................... 11 3.2 Partition Management .............................................................................................................................................. 11 3.2.1 Boot Area Partition and RPMB Area Partition ................................................................................................... 11 3.2.2 Enhanced Partition (Area) .................................................................................................................................. 12 3.2.3 User Density ....................................................................................................................................................... 12 3.3 Boot operation .......................................................................................................................................................... 12 3.4 Field Firmware Upgrade (FFU) .................................................................................................................................. 14 3.5 Cache ......................................................................................................................................................................... 14 3.6 Packed Commands .................................................................................................................................................... 14 3.7 Secure Delete ............................................................................................................................................................ 14 3.7.1 Sanitize ............................................................................................................................................................... 14 3.7.2 Secure Erase ....................................................................................................................................................... 14 3.7.3 Secure Trim ........................................................................................................................................................ 14 3.8 High Priority Interrupt (HPI) ...................................................................................................................................... 15 3.9 Device Health ............................................................................................................................................................ 15 3.10 Auto Power Saving Mode ........................................................................................................................................ 15 3.11 Enhanced Strobe ..................................................................................................................................................... 16 3.12 Performance ........................................................................................................................................................... 16 4 Register Value ................................................................................................................................................. 17 4.1 OCR Register ............................................................................................................................................................. 17 4.2 CID Register ............................................................................................................................................................... 17 4.2.1 Product name table (In CID Register) ................................................................................................................. 18 4.3 RCA Register .............................................................................................................................................................. 19 4.4 CSD Register .............................................................................................................................................................. 19 Confidential -239- Rev.1.0 December 2021

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Alliance Memory may also be referenced as

ACM
ALLIANCE MEMORY, INC.
ALLIANCE SEMI

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