Product Information

AS4C8M32MSA-6BINTR

AS4C8M32MSA-6BINTR electronic component of Alliance Memory

Datasheet
DRAM 256M 166MHz 8Mx32 Mobile LP SDRAM IT

Manufacturer: Alliance Memory
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1000: USD 6.5181 ea
Line Total: USD 6518.1

0 - Global Stock
MOQ: 1000  Multiples: 1000
Pack Size: 1000
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 1000
Multiples : 1000

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AS4C8M32MSA-6BINTR
Alliance Memory

1000 : USD 5.681
2000 : USD 5.681
5000 : USD 5.681

     
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AS4C8M32MSA-6BIN Revision History 256M (8M x 32) /RZ 3RZHU 6 5 0 AS4C803206 90ball FBGA PACKAGE Revision Details Date Rev 1.0 Preliminary datasheet Dec. 2017 Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211 Alliance Memory Inc. reserves the right to change products or specification without notice Confidential - 1 of 47 - Rev.1.0 Dec. 2017AS4C8M32MSA-6BIN 256M(8Mx32) Low Power SDRAM Features - LVCMOS Compatible IO Interface - Functionality - 90 ball FBGA with 0.8 mm ball pitch(8mm x 13mm) - Standard SDRAM Functionality - AS4C8M32MSA : Pb-Free & Halogen Free - Programmable burst lengths : 1, 2, 4, 8 or full page - 64ms refresh period (4K cycle) - JEDEC Compatibility Functional Description - Low Power Features The AS4C8M32MSA Family is high-performance CMOS - Auto TCSR(Temperature Compensated Self Refresh) Dynamic RAMs (DRAM) organized as 8M x 32. These - Partial Array Self Refresh power-saving mode devices feature advanced circuit design to provide low active - Deep Power Down Mode current and extremely low standby current. - Driver Strength Control The device is compatible with the JEDEC standard - Operating Temperature Ranges: LP-SDRAM specifications. - Industrial (-40 to +85) Table I.Ordering Information Temperature Max Clock (MHz) Product part No Org Package 166 MHz AS4C8M32MSA-6BIN Industrial -40C to 85C 90-ball FBGA 8M x 32 Table II.Key Specifications AS4C8M32MSA-6BIN -6 tCK(3) Clock Cycle time(min.) 6 ns tAC(3) Access time from CLK (max.) 5 .5ns tRAS Row Active time(min.) 4 8 ns Row Cycle time(min.) tRC 60ns Confidential - 2 of 47 - Rev.1.0 Dec. 2017

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
ACM
ALLIANCE MEMORY, INC.
ALLIANCE SEMI

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