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NC254-SN63-25-SC10

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Solder SOLDER PASTE NO CLEAN TYPE 5

Manufacturer: AIM

This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

26: USD 20.7089 ea
Line Total: USD 538.43

0 - Global Stock

MOQ: 26 Multiples: 26
Pack Size: 26

More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 - Warehouse 1 Ships to you between Fri. 10 May to Tue. 14 May MOQ : 26 Multiples : 26 NC254-SN63-25-SC10 AIM	26 : USD 20.4923 50 : USD 19.3565 100 : USD 18.4162 500 : USD 16.3767 1000 : USD 16.1935

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Additional Infomation About Product

NC254 NO CLEAN SOLDER PASTE FEATURES Broad Processing Window Clear Pin-Probe Testable Residue Halide-Free Excellent Wetting, Even Leadless Devices Reduces Voiding Under Micro-BGAs 24 Hour Stencil Life 12-14 Hour Tack Time DESCRIPTION NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior HANDLING & STORAGE wetting ability of NC254 results in bright, smooth, shiny, solder Alloy Parameter Time Temperature joints. NC254 offers very low post process residues, which remain crystal clear and probable at elevated temperatures. NC254 has Lead-Free Refrigerated 9 Months 0C-12C (32F- Shelf Life 55F) shown to reduce or eliminate voiding on micro-BGAs. Slump and humidity tolerances found in NC254 extend the solder pastes Lead-Free Unrefrigerated 4 Months < 25C (< 77F) Shelf Life useable life in facilities where environmental control is not at its optimum. Leaded Refrigerated 12 Months 0C-12C (32F- Shelf Life 55F) Leaded Unrefrigerated N/A N/A CHARACTERISTICS Shelf Life Do not add used paste to unused paste. Store used paste Low Halogen separately keep unused paste tightly sealed with internal plug or Content end cap in place. See AIMs paste handling guidelines for further information. Alloy and storage conditions may affect shelf life. Please refer to NC254 Certificate of Analysis for product Pause to Print specific information. Print Volume Capabilities CLEANING Pre-Reflow: AIM DJAW-10 solvent effectively removes NC254 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW- 10 will not dry NC254 and will enhance transfer properties. Do Low Residue Low Voiding not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse. Mitigates HiP Post-Reflow Flux Residue: NC254 residues do not require cleaning. AIM has worked closely with industry partners to NC254 NC257-2 NC258 ensure that NC254 residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information. Document Rev NF9p Page 1 of 3 REFLOW PROFILE Detailed profile information may be found at

HS Compliance

Tariff Desc

8311.30.00 -Coated rods and cored wire, of base metal, for soldering, brazing or welding by flame

AIM may also be referenced as

AIM
AIM INC.
AIM Products

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