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WS488 WATER SOLUBLE SOLDER PASTE FEATURES Excellent Wetting Extended Cleaning Window Superior Slump Resistance 8 Hour+ Stencil Life Wash With Water Alone Low Foaming DESCRIPTION AIMs WS488 water soluble solder paste has been engineered for powerful wetting performance on all solderable electronic surfaces, components, assemblies, and substrates. WS488 offers robust environmental tolerance, excellent print characteristics and 8+ hours of stencil life. WS488 has been developed to provide stable performance with all leaded and lead-free alloys. WS488 highly soluble residues are easily removed in plain water, even under low stand-off components. This all-purpose water soluble product was created to meet the industrys demand for a consistently reliable HANDLING & STORAGE water soluble solder paste. Parameter Time Temperature Sealed Refrigerated 6 Months 0C-12C (32F- CHARACTERISTICS Shelf Life 55F) Sealed Unrefrigerated 2 Weeks < 25C (< 77F) Shelf Life Do not add used paste to unused paste. Store used paste Print Quality separately keep unused paste tightly sealed with internal plug or end cap in place. After opening, solder paste shelf life is environment and application dependent. See AIMs paste Low Residue SIR Reliability handling guidelines for further information. Alloy and storage conditions may affect shelf life. Please refer to WS488 Certificate of Analysis for product specific information. Wetting Corrosion CLEANING Charactersitics Resistance Pre-Reflow: AIM DJAW-10 effectively removes WS488 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW- Eliminates 10 will not dry WS488 and will enhance transfer properties. Do Low Voiding Solder Balls not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse. Post-Reflow Flux Residue: WS488 residues can remain on the assembly after reflow for up to 2 weeks without corrosion. WS488 WS483 Cleaning is mandated and can be performed in plain water between 50C-60C (120F-140F) following with a final rinse in DI water. Document Rev NF8 Page 1 of 3 REFLOW PROFILE Detailed profile information may be found at