Product Information

THSF-cHL-B

THSF-cHL-B electronic component of ADLINK Technology

Datasheet
Heat Sinks High performance heatsink with fan cExpress-HL with threaded standoffs for bottom mounting

Manufacturer: ADLINK Technology
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 121.5175 ea
Line Total: USD 121.52

22 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
22 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

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THSF-cHL-B
ADLINK Technology

1 : USD 123.7205
10 : USD 117.9003
25 : USD 110.0274
50 : USD 108.7958
100 : USD 108.7958
250 : USD 105.6442

     
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RoHS - XON
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cExpress-HL COM Express Compact Size Type 6 Module with Intel Core i7/i5/i3 Processor Features 4th Generation Intel Core i7/i5/i3 Processor SoC Up to 16 GB DDR3L SDRAM at 1600MHz Two DDI channels, one LVDS supporting 3 independent displays Four PCIe x1 or 1 PCIe x4 GbE, four SATA 6 Gb/s, two USB 3.0, six USB 2.0 Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU GPU Feature Support Generation 7.5 graphics core architecture, supporting 4th Generation Intel Core Processors (Mobile) - 22nm (formerly codename Haswell-ULT) 3 independent and simultaneous display combinations of DisplayPort/ HDMI/ LVDS monitors Core i7-4650U 1.7 GHz (3.3 GHz Turbo), 15W (2C/GT3) Core i5-4300U 1.9 GHz (2.9 GHz Turbo), 15W (2C/GT2) Encode/transcode HD content Core i3-4010U 1.7 GHz (no Turbo) 3MB, 15W (2C/GT2) Celeron 2980U 1.6 GHz (no Turbo) 15W (2C/GT1) LVDS Supports : Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Single/dual channel 18/24-bit LVDS from eDP (two lanes) Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel Digital Display Interface TSX DDI1 supporting DisplayPort / HDMI / DVI Note: Availability of the features may vary between processor SKUs. DDI2 supporting DisplayPort / HDMI / DVI Memory Audio Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket Chipset Intel HD Audio integrated in SoC Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 9.0 support Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported) L3 Cache 4MB for i7-4650U, 3MB for i5-4300U and i3-4010U 2MB for 2980U Ethernet Intel MAC/PHY: i218LM (Enterprise SKU) with AMT 9.0 support Expansion Busses 4 PCI Express x1: lanes 0/1/2/3 Interface: 10/100/1000 GbE connection LPC bus, SMBus (system), I2C (user) I/O Interfaces SEMA Board Controller USB: 2x USB 3.0 (USB 0,1) and 6x USB 2.0 (USB2,3,4,5,6,7) Supports : Voltage/Current monitoring, Power sequence debug support, AT/ SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Serial: 2 UART ports COM1/2 with console redirection Control GPIO: 4 GPO and 4 GPI with interrupt Debug Headers Super I/O 40-pin multipurpose flat cable connector On carrier if needed (standard support for W83627DHG-P) Use in combination with DB-40 debug module Providing BIOS POST code LED, BMC access, SPI BIOS flashing, power TPM testpoints, debug LEDs Chipset: Atmel AT97SC3204 60-pin XDP header for ICE debug of CPU/Chipset Type: TPM 1.2 Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications Power Mechanical and Environmental Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Form Factor: PICMG COM.0: Rev 2.1 Type 6 Wide Input: ATX = 5~20 V / 5Vsb 5% or AT = 5~20V Dimension: Compact size: 95 mm x 95 mm Management: ACPI 4.0 compliant, Smart Battery support Operating Temperature Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, Standard: 0C to +60C WOL S3/S4/S5) Extreme Rugged: -40C to +85C (build option) ECO mode: Supports deep S5 mode for power saving Humidity Operating Systems 5-90% RH operating, non-condensing Standard Support 5-95% RH storage (and operating with conformal coating) Windows 7/8 32/64-bit, Linux 32/64-bit Shock and Vibration Extended Support (BSP) IEC 60068-2-64 and IEC-60068-2-27 WES7/8, Linux , VxWorks MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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