Product Information

CM-920-R-17

CM-920-R-17 electronic component of ADLINK Technology

Datasheet
Single Board Computers CORE MODULE 920 Intel Core i7-3517UE

Manufacturer: ADLINK Technology
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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CM-920-R-17
ADLINK Technology

1 : USD 3447.3194
10 : USD 3414.1881
25 : USD 3332.2333
50 : USD 3233.8995
N/A

Obsolete
     
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RoHS - XON
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Flash
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CM-920 Extreme Rugged PCI/104-Express Single Board Computer with 3rd Generation Intel Core Processor Features Dual-core 3rd Generation Intel Core Processor Up to 4GB industrial grade soldered-down ECC 1600MHz DDR3 memory 8GB industrial grade solid state drive (SSD) One PCIe x16 (Gen 3) and 1 x4 or 4 x1 (Gen 2) Two SATA 6 Gb/s ports, two Gigabit Ethernet, four USB 2 .0 interfaces, and two serial ports PCI/104-Express Type 1 and PCI/104 expansion interfaces Extreme Rugged operating temperature: 40C to +85C 50% thicker PCB for high vibration environments Specifications Core System Video CPU Integrated Graphics Intel Core i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB L3 cache, 17W, HD Graphics 4000 at 350-1000 MHz dual core Integrated Video Intel Celeron 807UE 1.0GHz, 1MB L3 cache, 10W, single core DirectX 11.0, OpenGL 3.1, and OCL 1.1 Memory Media Processing 2 or 4GB single channel industrial grade solder down ECC 1600 MHz DDR3 memory Decode (HW JPEG & MJPEG decode), encode (full HW MPEG2 encode), transcode Intel Clear Video HD Technology + enhanced media processing Embedded BIOS VGA Interface AMI UEFI with CMOS backup in 16 MB SPI flash Analog VGA support with 300 MHz DAC, Analog monitor support up to Hardware Monitor QXGA (2048 x 1536) and VGA hot plug Supply voltages and CPU temperature LVDS Interface Watchdog Timer Dual-channel 18/24-bit LVDS Programmable timer range to generate RESET Digital Display Interface Technologies One DVI PAVP 3.0, Intel AMT 8.0, Intel VT, Intel AES-NI, Intel HT, Intel HD Graphics with Dynamic Frequency, Intel Turbo Boost , Dynamic Turbo, Intel AVX 1.0, Power Intel Quick Sync Video Standard Input Expansion Busses 5V (3.3V and 12V if required by the PCI/104-Express stack) PCI/104 (32-bit 33/66MHz) Power States PCI/104-Express Type 1 with 1 of PCI Express x16 (Gen3) bus SMBus (system) Supports S1, S4 2 of USB 2.0, 4 of PCI Express x1 Power Consumption Ethernet 9W typical 10/100/1000Mbps 2x GbE: 1x PCH using Intel 82579 PHY, 1x Intel 82574 MAC/PHY Audio Chipset Integrated on Mobile Intel QM67 Express Chipset, available on HDMI portSpecifications I/O Interfaces Mechanical and Environmental Chipset Form Factor Integrated on Mobile Intel QM67 Express Chipset PCI/104 Express USB Dimension Four USB 2.0 ports (plus two to the PCI/104-Express stack) 116mm x 96mm SATA Operating Temperature Two SATA 6 Gb/s with support for RAID 0,1 Standard: -20C to +70C Extreme Rugged: -40C to +85C (CPU throttling at 800MHz, no throttling Storage to +75C) Onboard 8GB industrial grade SSD Storage Temperature Serial -55C to +85C Two RS-232 Serial ports implemented in LPC based Super I/O Humidity 90% at 60C non-condensing Operation System Standard Support Shock and Vibration Windows 7, Linux 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B Operating: 11.96 Grms, 50-2,000 Hz, each axis, MIL-STD-202G Method 214A Extended Support (BSP) WES 7, WES 2009, WEC 7, VxWorks 6.9, QNX 6.5 HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Intelligent Middleware SEMA Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

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