MEPIC www.vishay.com Vishay Sfernice Massive Electro-Pyrotechnic Initiator Chip Resistor FEATURES Surface Mount Design for standard assembly process Available SMD version only Active area designed upon performances Available Case size 0805 Firing energy down to 1.5 mJ Firing time down to 250 s The Massive Electro-Pyrotechnic Initiator Chips (MEPIC) are (1) Ohmic value: 1 to 8 10 % (typical) resistors dedicated to pyrotechnic applications. The MEPIC Joule effect ignition resistors are the Surface Mount Device (SMD) variants from the established NiCr on FR type substrate technology from Easy set up by design of firing levels Vishay Sfernice. The standard case geometry (SMD) Very predictable, reproducible and reliable behavior enables the implementation of assembly process commonly Compatibility with pyrotechnic element has to be tested in used in the electronic component industry (pick and place, real environment reflow soldering on flat PCB used as header) providing high Material categorization: for definitions of compliance productivity. The principle of MEPIC is to convert electrical please see www.vishay.com/doc 99912 energy into heat energy in a precise electro-thermal profile Notes for the purpose of initiating a series of pyrotechnic events * This datasheet provides information about parts that are in a controlled energetic reaction. In the mining industry RoHS-compliant and / or parts that are non-RoHS-compliant. For this effect is commonly used for the ignition of electronic example, parts with lead (Pb) terminations are not RoHS-compliant. detonators (digital blasting). Other industries such as Please see the information / tables in this datasheet for details. (1) firework (e-match manufacturing) and demolition (various For ohmic value < 3 the tolerance will be discussed with Vishay Sfernice electric detonators) are also focused applications. The MEPIC design has been developed specifically to offer an alternative to the Bridge Wire (BW) technology, insuring at least the same level of performances, while providing cost efficient assembly process and initiator design alternatives. TECHNOLOGY The MEPIC active area (heating zone) will be impregnated by the user with a primary pyrotechnic material (usually wet primer followed by drying) in such way to ensure an intimate contact for an optimum heat transfer of thermal energy. The geometry of the active area of the MEPIC, and both the primer chemistry and its impregnation method, will determine the global performances. Note that the active area of MEPIC shall not be put in direct contact with explosive powder as grain size will not ensure intimate contact and will induce non reproducible and non reliable performances. The two main characteristics of a MEPIC resistor are their All Fire (AF) and No Fire (NF) performances: - All Fire (AF) represents the command pulse where the major amount of the dissipated energy will be transferred to the primer to generate the ignition. Customer will have to provide Vishay Sfernice with All Fire conditions, usually with capacitance discharge parameters or with Minimum Current or Voltage and corresponding short pulse duration. - No Fire (NF) represents the immunity of the resistor with primer to the environmental electro-magnetic pollution and electric continuity test, where the major amount of the dissipated energy will be transferred to the substrate to ensure no ignition. Customer will have to provide Vishay Sfernice with No Fire conditions, usually maximum current or voltage and corresponding longest duration. In case of applicable capacitance discharge test the parameters shall also be provided. ASSEMBLY PRECAUTIONS In order to obtain reproducible ignition performances it is important that the assembly process fulfills the following criteria: - Do not use iron soldering method to mount the MEPIC on its header because uncontrolled amount of solder could impact the heat transfer (potential misfire or ignition delay) and local over heating may damage the MEPIC (deformation that may cause active area cracks). - Take specific precautions , such as no air bubble during preparation and application of primer, in order to ensure the intimate contact of pyrotechnic primer and MEPIC active area (potential misfire). - Take specific handling precaution in order not to damage MEPIC active area (ex: pickup head design for pick and place or specific fixing tools in the entire assembly process. - All along the assembly process, take specific care to extreme thermo-mechanic stress that could be applied to the MEPIC (such as stress induced during over molding) because the active area of MEPIC is subjected to crack (and generate unstable resistance value). - The MEPIC reliability is only guaranteed for one single reflow profile. - In case of necessity to dismantle a MEPIC, another MEPIC must be used (no rework is allowed). - Pay specific attention to the cleaning process after reflow soldering in order not to damage the active area and to keep it clean from various pollutions. Revision: 14-Jan-15 Document Number: 53058 1 For technical questions, contact: sferthinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 MEPIC www.vishay.com Vishay Sfernice STANDARD ELECTRICAL SPECIFICATIONS SIZE / CASE RESISTANCE RANGE RESISTANCE TOLERANCE MODEL (1) DESIGNATION % MEPIC (SMD) 0805 1 to 8 10 to 30 Note (1) Detailed dimensions are specified in Dimensions and Tolerances table. RANGE OF IGNITION PERFORMANCES NO FIRE NO FIRE ALL FIRE IGNITION ALL FIRE MODEL CURRENT DURATION CURRENT TIME ENERGY A s A ms J MEPIC (SMD) 0.5 to 1.2 2 to 10 Down to 1 Down to 0.25 Down to 1000 Note Ignition performances are dependent on both pyrotechnic primer chemistry and active area geometry. DIMENSIONS AND TOLERANCES in millimeters (inches) ACTIVE AREA INSULATION BACK SIDE SIZE / CASE WIDTH LENGTH THICKNESS WIDTH MODEL DISTANCE PADS DESIGNATION W L T TOLERANCE I P A 2.00 0.15 1.25 0.10 0.6 0.1 0.45 0.15 0.01 MEPIC (SMD) 0805 - (0.080 0.006) (0.050 0.004) (0.024 0.004) (0.018 0.006) ( 0.0004) CONSTRUCTION NiCr active area Tin or Silver Copper NiCr Copper Substrate Substrate Tin or Silver Substrate: epoxy based (FRx type) Terminations: SMD wraparound Resistive element: NiCr Tin plated copper or silver plated copper Revision: 14-Jan-15 Document Number: 53058 2 For technical questions, contact: sferthinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000