Introduction: DIPLOMAT Cases, Towers and Caseframes DIPLOMAT 19 AND 1012 CASES DIPLOMAT 19 and 1012 cases are designed for the direct mounting of subracks and chassis to IEC 297-1 and DIN 41494. They are strong and lightweight, with inherent EMC protection due to their metal construction. They have also obtained an IP rating of 30. A new fan plinth design has improved the cooling performance of this unit significantly, results of which are published on page 4 of this brochure. A very large range of ex-stock sizes are available and can now be assembled to order and despatched with accessories fitted. Due to the nature of its construction, this unit is also easily customised, so please ask our Sales Office for more details. DIPLOMAT 19 Cases DIPLOMAT-RF 19 AND 1012 CASES DIPLOMAT-RF 19 and 1012 cases are designed to suit applications requiring a higher level of EMC protection to shield sensitive electronic equipment. The significantly higher level of protection is achieved by selectively placing BeCu fingers around joints in the enclosure to attain the level of EMC protection required. Because the fingers can be added or removed easily, the level of shielding may be altered to find the most cost-effective solution. DIPLOMAT-RF 19 Cases DIPLOMAT COMPUTER TOWERS DIPLOMAT Computer Towers are designed for direct mounting of subracks or chassis and conform to IEC 297-1 and DIN 41494. The towers are available in two widths and can accept up to 12U of subracks or chassis. All units are supplied assembled. DIPLOMAT Computer Tower DIPLOMAT CASEFRAMES EUROCARD COMPATIBLE DIPLOMAT caseframes are designed for the direct mounting of circuit boards and modules to IEC 297-3, DIN 41494 Pt. 5 and BS 5954. They are available with EMC conversion kits which give high levels of attenuation. The basic unit however will also afford EMC protection due to its metal construction. The cooling performance of this unit has also been improved, especially in the slot 1 region of VME systems, where hot cards are often situated. These units are supported by a range of accessories which increase its versatility and application environment. These units are also rated at IP30. DIPLOMAT Caseframes 2 3DIPLOMAT Case Cooling NEW AND IMPROVED COOLING PERFORMANCE The DIPLOMAT range of enclosures has improved cooling performance in both the standard and fan plinth versions. The fan plinth version has a wider plinth with an increased ventilation surface area to increase the volume of air flow. The plinth can either act as a chamber for air collection when fans are mounted on the rear panel of the unit (pull through air flow) or can be used to mount fans directly hence employing a push method of cooling. Fans can be mounted in the plinth and on the rear panel employing a push-pull method of cooling. Ducting plates can be placed in the plinth to give additional direction to the air flow, concentrating the flow towards hot cards or components. The level of cooling performance achieved will depend on a number of variables, such as the internal component architecture and hot component positioning. A test DIPLOMAT Case was set up where a 6U DIPLOMAT unit 19 wide was fitted with a populated card frame, 220mm boards to a 6U full width backplane, and air flow indicating componentry. Two 95CFM fans were mounted on the rear panel and a standard ducting plate used to direct the air across the cards, the results recorded are Air fl ow shown below. The results below were measurements of air velocity taken from the standard DIPLOMAT with new 38mm deep plinth with ducting plate, and 2 x 95 CFM fans mounted on the rear panel. The top panel was non ventilated. Velocity M/S Bottom Middle HP Position Top Card Postion DIPLOMAT Airfl ow Velocities 2 x 95CFM Rear Panel (New Style Plinth) Rear of PCB Top Velocity m/s Card Guide Position PCB Card Position (HP) Side Elevation PCB 4 5