SMT Power Inductors Shielded Drum Core - PF0601NL Series Height: 3mm Max Footprint: 6.9mm x 6.5mm Max Current Rating: up to 2A Inductance Range: 2.9H to 330H 260C reflow peak temperature qualified Electrical Specifications 25C - Operating Temperature -40C to +130C 6 7 8 Inductance Inductance Saturation Heating Core Loss 2,3 5 Part 0ADC Irated Irated DCR (m) Current Current IDC Factor SRF Number (H 20%) (H TYP) (A) MAX -20% (A) +45C (A) (K2) (MHz) PF0601.292NL 2.9 2.6 2.0 55 2.0 3.3 1500 >40 PF0601.402NL 4.0 3.5 1.63 69 1.63 3.0 1700 >40 PF0601.552NL 5.5 4.8 1.5 75 1.5 2.6 2000 >40 PF0601.103NL 10 8.8 1.1 135 1.1 2.1 2700 31 PF0601.123NL 12 11 1.0 140 1.0 2.0 3100 30 PF0601.153NL 15 13 0.9 155 0.9 1.7 3300 26 PF0601.183NL * 18 16 0.8 210 0.8 1.6 3700 23 PF0601.223NL 22 19 0.74 230 0.74 1.5 4000 20 PF0601.273NL * 27 24 0.66 305 0.66 1.4 4600 19 PF0601.333NL 33 29 0.59 345 0.59 1.3 4900 17 PF0601.393NL 39 34 0.54 445 0.54 1.2 5500 16 PF0601.473NL 47 41 0.5 515 0.5 1.0 5900 14 PF0601.563NL 56 49 0.46 575 0.46 0.9 6400 13 PF0601.683NL 68 60 0.42 765 0.42 0.85 7200 12 PF0601.823NL 82 72 0.38 840 0.38 0.80 7800 11 PF0601.104NL 100 88 0.34 1120 0.34 0.67 8700 9.0 PF0601.124NL 120 106 0.31 1250 0.31 0.62 9400 8.0 PF0601.154NL 150 132 0.28 1440 0.28 0.60 11000 7.0 PF0601.184NL * 180 158 0.26 1920 0.26 0.52 12000 6.5 PF0601.224NL 220 194 0.23 2200 0.23 0.45 13000 6.1 PF0601.274NL * 270 238 0.22 3000 0.22 0.40 14000 5.8 PF0601.334NL 330 290 0.19 3300 0.19 0.30 16000 5.1 1 power.pulseelectronics.com SPM2007 20 (02/19) SMT Power Inductors Shielded Drum Core - PF0601NL Series Mechanical Schematic P1166.XXXNL Weight ..................0.35 grams Tape & Reel ..............1200/reel Inches Dimensions: mm Unless otherwise specified, .004 all tolerances are 0,10 Inductance vs Current Characteristics Notes: 1. Unless otherwise specified, all testing is made at 100kHz, 0.1VAC. 8. In high volt*time (Et) or ripple current applications, additional heating in the 2. Optional Tape & Reel packaging can be ordered by adding a T suffix to the part component can occur due to core losses in the inductor which may necessitate number (i.e P1166.102NL becomes P1166.102NLT). Pulse complies with industry derating the current in order to limit the temperature rise of the component. In order standard Tape and Tape & Reel specification EIA481. to determine the approximate total loss (or temperature rise) for a given application, 3. The NL suffix indicates an RoHS-compliant part numer. Non-NL suffixed parts are both copper losses and core losses should be taken into account. not necessarily RoHS compliant, but are electrically and mechanically equivalent to NL versions. If a part number does not have the NL version, but an RoHS compliant Estimated Temperature Rise: version is required, please contact Pulse for availability833 4. Temperature of the component (ambient plus temperature rise) must be within Trise = Total loss (mW) / K0 (C) specified operating temperature range. Total Loss = Copper loss + Core loss (mW) 2 5. The rated current (Irated) as listed is either the saturation current or the heating Copper loss = IRMS x DCR (Typical) (mW) 2 2 1/2 current depending on which value is lower. Irms = IDC + I /12 (A) 1.23 2.38 6. The saturation current, Isat, is the current at which the component inductance drops Core loss = K1 x f (kHz) x Bac (Ga) (mW) by the indicated percentage (typical) at an ambient temperature of 25C. This current Bac (peak to peak flux density) = K2 x I (Ga) is determined by placing the component in the specified ambient environment and = K2/L (H) x Et (V-Sec) (Ga) applying a short duration pulse current (to eliminate self-heating effects) to the where f varies between 25kHz and 1MHz, and Bac is less than 2500 Gauss. component. K2 is a core size and winding dependent value and is given for each p/n in the 7. The heating current, Idc, is the DC current required to raise the component tempera- proceeding datasheets. K0 & K1 are platform and material dependant constants and ture by the indicated delta (approximately). The heating current isdetermined by are given in the table below for each platform. mounting the component on a typical PCB and applying current for 30 minutes. The temperature is measured by placing the thermocouple on top of the unit under test. * Contact Pulse for availability 2 power.pulseelectronics.com SPM2007 20 (02/19)