PA4340.221NLT Pulse

SMT Power Inductor High Current Molded Power Inductor - PA4340.XXXNLT Series NEW - AEC-Q200 Qualified Height: 3.0mm Max Footprint: 6.0mm x 5.4mm Max Current Rating: up to 23A Inductance Range: 0.10uH to 33uH Shielded construction and compact design High current, low DCR, and high efficiency Minimized acoustic noise and minimized leakage flux Electrical Specifications 25C - Operating Temperature -40C to +125C DC Saturation Resistance Inductance Rated Current 100KHz, 1V Current MAX. TYP. Max. Part Number uH A m m A PA4340.101NLT 0.1030% 23.0 3.0 2.5 27.0 PA4340.201NLT 0.2030% 16.0 3.2 2.6 25.0 PA4340.221NLT 0.2230% 15.5 4.4 3.7 21.0 PA4340.331NLT 0.3320% 14.0 5.0 4.3 18.0 PA4340.471NLT 0.4720% 12.0 7.4 6.4 16.0 PA4340.681NLT 0.6820% 8.5 12.0 10.0 14.0 PA4340.102NLT 1.0020% 7.0 14.0 13.0 11.0 PA4340.122NLT 1.2020% 6.5 16.0 14.0 11.0 PA4340.152NLT 1.5020% 6.0 25.0 16.0 10.0 PA4340.222NLT 2.2020% 5.5 35.0 25.0 9.0 PA4340.332NLT 3.3020% 5.0 38.0 32.0 8.0 PA4340.472NLT 4.7020% 4.6 53.0 50.0 6.0 PA4340.562NLT 5.6020% 4.25 63.0 55.0 4.5 PA4340.682NLT 6.8020% 4.0 76.2 68.0 4.3 PA4340.103NLT 10.0020% 2.75 128.0 110.0 3.5 PA4340.153NLT 15.020% 2.1 190.0 165.0 2.6 PA4340.183NLT 18.020% 2.0 230.0 195.0 2.3 PA4340.223NLT 22.020% 1.9 250.0 220.0 1.7 PA4340.333NLT 33.020% 1.6 440.0 380.0 1.6 USA 858 674 8100 Germany 49 2354 777 100 Singapore 65 6287 8998 Shanghai 86 21 62787060 China 86 755 33966678 Taiwan 886 3 4356768 1 pulseelectronics.com P767.D (11/16)SMT Power Inductor High Current Molded Power Inductor - PA4340.XXXNLT Series Notes: 1. Actual temperature of the component during system operation (ambient plus tempera- 3. The rated current is the DC current required to raise the component temperature by ture rise) must be within the standard operating range. approximately 40C. Take note that the components performanc varies depending on the 2. The saturation current is the current at which the initial inductance drops approximately system condition. It is suggested that the component be tested at the system level, to 30% at the stated ambient temperature. This current is determined by placing the com- verify the temperature rise of the component during system operation. ponent in the specified ambient environment and applying a short duration pulse cur- 4. The part temperature (ambient+temp rise) should not exceed 125C under worst case rent (to eliminate self-heating effect) to the component. operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool- ing provisions all affect the part temperature. Part temperature should be verified in the end application. Mechanical PA4340.XXXNLT Final Layout SUGGESTED PAD LAYOUT Series A B C D E F G H PA4340.XXXNLT 6.0 MAX 5.4 MAX 3.0 MAX (1.5) 3.5 MAX (1.8) (2.0) (2.5) All Dimensions in mm. TAPE & REEL INFO E B T P P D 2 0 0 F W A N K P 0 1 G SURFACE MOUNTING TYPE, REEL/TAPE LIST REEL SIZE (mm) TAPE SIZE (mm) QTY A B G N E F D P P P W T K PCS/REEL 0 1 0 2 0 PA4340.XXXNLT 330 N/A 12 100 1.75 3.5 1.5 8 4 2 8 0.35 3.3 2000 2 pulseelectronics.com P767.D (11/16)