Product Information

MD7IC2251NR1

MD7IC2251NR1 electronic component of NXP

Datasheet
RF Amp Module Dual Power Amp 2.17GHz 32V 15-Pin TO-270 W T/R

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

2: USD 106.6527 ea
Line Total: USD 213.31

0 - Global Stock
MOQ: 2  Multiples: 1
Pack Size: 1
     
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RoHS - XON
Icon ROHS
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Type
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Pin Count
Power Supply Requirement
Dual Supply Voltage Typ
Single Supply Voltage Min
Single Supply Voltage Max
Dual Supply Voltage Max
Rad Hardened
Dual Supply Voltage Min
Number Of Channels
Single Supply Voltage Typ
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DocumentNumber:MD7IC2251N FreescaleSemiconductor Rev.0,5/2012 TechnicalData RFLDMOSWidebandIntegrated PowerAmplifiers MD7IC2251NR1 The MD7IC2251N wideband integrated circuit is designed with on--chip MD7IC2251GNR1 matchingthatmakesit usablefrom2110--2170MHz. Thismulti--stage structure is rated for 26 to 32 volt operation and covers all typical cellular base station modulation formats. TypicalDoherty Single--Carrier W--CDMA CharacterizationPerformance: V =28Volts,I =80mA,I = 260mA, V =1.4Vdc, 2110--2170MHz,12WAVG.,28V DD DQ1(A+B) DQ2A GS2B P = 12Watts Avg., IQ MagnitudeClipping, ChannelBandwidth= 3.84MHz, SINGLEW--CDMA out Input SignalPAR = 9.9dB @ 0.01%Probability onCCDF. RFLDMOSWIDEBAND INTEGRATEDPOWERAMPLIFIERS G PAE OutputPAR ACPR ps Frequency (dB) (%) (dB) (dBc) 2110MHz 28.8 38.2 7.1 --34.6 TO--270WB--14 PLASTIC 2140MHz 29.0 37.9 7.1 --36.2 MD7IC2251NR1 2170MHz 29.2 37.4 6.9 --36.1 Capableof Handling10:1VSWR, @32Vdc, 2140MHz, 63Watts CW Output Power (3dB Input Overdrivefrom RatedP ) out TO--270WB--14GULL (1) Typical P @3dB CompressionPoint 58Watts out PLASTIC Features MD7IC2251GNR1 100%PAR Testedfor GuaranteedOutput Power Capability ProductionTestedinaSymmetricalDoherty Configuration CharacterizedwithLarge--SignalLoad--PullParameters andCommonSourceS--Parameters On--ChipMatching(50Ohm Input, DC Blocked) (2) IntegratedQuiescent Current TemperatureCompensationwithEnable/DisableFunction IntegratedESD Protection 225C CapablePlastic Package InTapeandReel. R1Suffix = 500Units, 44mm TapeWidth, 13inchReel. V DS1A (3) Carrier CARRIER V 1 DS1A V 2 GS2A RF RF /V inA out1 DS2A 14 V 3 GS1A RF /V out1 DS2A RF 4 inA NC 5 NC 6 V GS1A QuiescentCurrent NC 7 (2) V TemperatureCompensation GS2A NC 8 RF 9 13 RF /V inB out2 DS2B V GS1B QuiescentCurrent V 10 GS1B (2) V TemperatureCompensation V 11 GS2B GS2B V 12 Peaking DS1B (3) PEAKING (TopView) RF inB RF /V out2 DS2B Note: Exposed backside of the package is V thesourceterminalforthetransistors. DS1B Figure1.FunctionalBlockDiagram Figure2.PinConnections 1. P3dB=P +7.0dBwhereP istheaverageoutputpowermeasuredusinganunclippedW--CDMAsingle--carrierinputsignalwhereoutput avg avg PARis compressedto7.0dB @0.01%probability onCCDF. 2. RefertoAN1977,QuiescentCurrentThermalTrackingCircuitintheRFIntegratedCircuitFamilyandtoAN1987,QuiescentCurrentControl fortheRFIntegratedCircuitDeviceFamily.GotoTable1.MaximumRatings Rating Symbol Value Unit Drain--SourceVoltage V --0.5,+65 Vdc DS Gate--SourceVoltage V --0.5,+10 Vdc GS OperatingVoltage V 32,+0 Vdc DD StorageTemperatureRange T --65to+150 C stg CaseOperatingTemperature T 150 C C (1,2) OperatingJunctionTemperature T 225 C J InputPower P 28 dBm in Table2.ThermalCharacteristics (2,3) Characteristic Symbol Value Unit FinalDohertyApplication ThermalResistance,JunctiontoCase R C/W JC CaseTemperature78C,P =12WCW out Stage1,28Vdc,I =80mA 4.8 DQ1(A+B) Stage2,28Vdc,I =260mA,V =1.4Vdc 1.5 DQ2A GS2B CaseTemperature89C,P =50WCW out Stage1,28Vdc,I =80mA 3.7 DQ1(A+B) Stage2,28Vdc,I =260mA,V =1.4Vdc 1.0 DQ2A GS2B Table3.ESDProtectionCharacteristics TestMethodology Class HumanBody Model(perJESD22--A114) 1A MachineModel(perEIA/JESD22--A115) A ChargeDeviceModel(perJESD22--C101) II Table4.MoistureSensitivityLevel TestMethodology Rating PackagePeakTemperature Unit PerJESD22--A113,IPC/JEDECJ--STD--020 3 260 C Table5.ElectricalCharacteristics (T =25Cunless otherwisenoted) A Characteristic Symbol Min Typ Max Unit (4) Stage1 -- OffCharacteristics ZeroGateVoltageDrainLeakageCurrent I 10 Adc DSS (V =65Vdc,V =0Vdc) DS GS ZeroGateVoltageDrainLeakageCurrent I 1 Adc DSS (V =28Vdc,V =0Vdc) DS GS Gate--SourceLeakageCurrent I 1 Adc GSS (V =1.5Vdc,V =0Vdc) GS DS (4) Stage1 -- OnCharacteristics GateThresholdVoltage V 1.2 2.0 2.7 Vdc GS(th) (V =10Vdc,I =23 Adc) DS D GateQuiescentVoltage V 2.7 Vdc GS(Q) (V =28Vdc,I =80mAdc) DS DQ1(A+B) FixtureGateQuiescentVoltage V 6.0 7.0 8.0 Vdc GG(Q) (V =28Vdc,I =80mAdc,MeasuredinFunctionalTest) DD DQ1(A+B) 1. Continuous useatmaximum temperaturewillaffectMTTF. 2. MTTFcalculatoravailableat

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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