Product Information

BF556C,215

BF556C,215 electronic component of NXP

Datasheet
Trans JFET N-CH 30V 18mA Si 3-Pin TO-236AB T/R
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

54: USD 0.6892 ea
Line Total: USD 37.22

0 - Global Stock
MOQ: 54  Multiples: 1
Pack Size: 1

Read More Specifications

     
Manufacturer
Product Category
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Packaging
Id Continuous Drain Current
Gate Source Voltage Max
Package Type
Pin Count
Operating Temperature Classification
Drain Gate Voltage Max
Drain Source Volt Max
Channel Type
Configuration
Rad Hardened
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Additional Infomation About Product

BF556A; BF556B; BF556C N-channel silicon junction field-effect transistors Rev. 4 15 September 2011 Product data sheet 1. Product profile 1.1 General description N-channel symmetrical silicon junction field-effect transistors in a SOT23 package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Low leakage level (typ. 500 fA) High gain Low cut-off voltage. 1.3 Applications Impedance converters in e.g. electret microphones and infrared detectors VHF amplifiers in oscillators and mixers. 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V drain-source -- 30 V DS voltage (DC) V gate-source cut-off I =200 A; 0.5 - 7.5 V GSoff D voltage V =15V DS I drain current V =0V; V =15V DSS GS DS BF556A 3 - 7 mA BF556B 6 - 13 mA BF556C 11 - 18 mA P total power T 25 C--250mW tot amb dissipation y forward transfer V =0V; V =15V 4.5 - - mS fs GS DS admittance SOT23BF556A; BF556B; BF556C NXP Semiconductors N-channel silicon junction field-effect transistors 2. Pinning information Table 2. Pinning Pin Description Simplified outline Symbol 1 source (s) 3 d 2drain (d) g s 3gate (g) sym054 12 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BF556A - plastic surface mounted package; 3 leads SOT23 BF556B BF556C 4. Marking Table 4. Marking [1] Type number Marking code BF556A 24* BF556B 25* BF556C 26* [1] * = p: made in Hong Kong. * = t: made in Malaysia. * = W: made in China. BF556A_BF556B_BF556C All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 15 September 2011 2 of 14

HS Compliance

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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