ISD4003 SERIES ISD4003 SERIES SINGLE-CHIP, MULTIPLE-MESSAGES VOICE RECORD/PLAYBACK DEVICES 4-, 5-, 6-, AND 8-MINUTE DURATION Publication Release Date: March 3, 2017 - 1 - Revision 1.32 ISD4003 SERIES 1. GENERAL DESCRIPTION ............................................................................................................... 3 2. FEATURES ....................................................................................................................................... 4 3. BLOCK DIAGRAM ............................................................................................................................ 5 4. PIN CONFIGURATION ..................................................................................................................... 6 5. PIN DESCRIPTION ........................................................................................................................... 7 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 12 6.1. Detailed Description ................................................................................................................ 12 6.2. Serial Peripheral Interface (SPI) Description .......................................................................... 13 6.2.1 OPCODES ....................................................................................................................... 14 6.2.2 SPI Diagrams ................................................................................................................... 15 6.2.3 SPI Control and Output Registers .................................................................................... 16 7. TIMING DIAGRAMS ....................................................................................................................... 18 8. ABSOLUTE MAXIMUM RATINGS.................................................................................................. 20 8.1. Operating Conditions............................................................................................................... 21 9. ELECTRICAL CHARACTERISTICS ............................................................................................... 22 9.1. Parameters For Packaged Parts ............................................................................................. 22 9.2. Parameters For Die ................................................................................................................. 25 9.3. SPI AC Parameters ................................................................................................................. 26 10. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27 11. PACKAGING AND DIE INFORMATION ......................................................................................... 30 11.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC) ................................................................ 30 11.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) .......................................................... 31 11.3. Die Information .................................................................................................................... 32 12. ORDERING INFORMATION .......................................................................................................... 34 13. VERSION HISTORY ....................................................................................................................... 35 Publication Release Date: March 3, 2017 - 2 - Revision 1.32