MAX6604 19-3837 Rev 3 10/11 Precision Temperature Monitor for DDR Memory Modules General Description Features The MAX6604 high-precision temperature sensor is JEDEC Compliant designed for thermal monitoring functions in DDR memo- 1C Temperature-Monitoring Accuracy ry modules. The device is readable and programmable 2 Overtemperature Interrupt with Programmable through the 2-wire SMBus/I C-compatible interface. Threshold Three address inputs set the bus address for the temper- ature sensor to provide up to eight devices on one bus. +2.7V to +3.6V Operating Voltage Range The internal thermal sensor continuously monitors the 2 SMBus/I C-Compatible Interface temperature and updates the temperature data eight 300A Typical Operating Current times per second. The master can read the tempera- ture data at any time. Since the thermal sensor is locat- 3A Typical Shutdown Current ed on the memory module, temperature data recorded -20C to +125C Operating Temperature Range accurately represents the temperature of the compo- 8-Pin TSSOP and 8-Pin TDFN (2mm x 3mm) nents on the module. Consequently, the MAX6604 pro- Packages vides a much more accurate measurement of module temperature than techniques involving temperature Ordering Information sensors on the motherboard. In addition, the device responds more quickly to temperature changes on the SERIAL- module than a motherboard sensor. SPECIAL CLOCK PART PIN-PACKAGE TOP The MAX6604 also features an interrupt-output indica- FREQUENCY MARK tor for temperature-threshold monitoring. The threshold (kHz) levels are programmable through the digital interface. 8 TDFN-EP* MAX6604AATA+ 400 AAR The MAX6604 operates from -20C to +125C, and is (MO229-WCED-2) available in JEDEC-standard 8-pin TSSOP and 8-pin MAX6604AAHA+ 400 8 TSSOP TDFN (2mm x 3mm) packages. +Denotes a lead(Pb)-free/RoHS-compliant package. Applications *EP = Exposed pad. Note: These devices operate over the -20C to +125C operat- Memory Modules ing temperature range. Desktop Computers Notebook Computers Typical Application Circuit appears at end of data sheet. Workstations Networking Equipment Pin Configurations TOP VIEW + V EVENT SCL SDA CC A0 1 8 V CC 867 5 A1 2 7 EVENT MAX6604 MAX6604 A2 3 6 SCL EP + 4 5 SDA GND 1 2 34 A0 A1 A2 GND TDFN TSSOP Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLEPrecision Temperature Monitor for DDR Memory Modules ABSOLUTE MAXIMUM RATINGS All Input and Output Voltages ..................................-0.3V to +6V Junction Temperature......................................................+150C Continuous Power Dissipation (T = +70C) Operating Temperature Range .........................-20C to +125C A 8-Pin TDFN (derate 16.7mW/C above +70C) ......1333.3mW Storage Temperature Range .............................-65C to +150C 8-Pin TSSOP (derate 8.1mW/C above +70C) ........646.7mW Lead Temperature (soldering, 10s) .................................+300C ESD Protection (all pins, Human Body Model) ....................2kV Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +2.7V to +3.6V, T = -20C to +125C, unless otherwise noted. Typical values are at V = +3.3V, T = +25C.) (Note 1) CC A CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Supply Voltage Range V +2.7 +3.6 V CC 0.125 C Temperature Resolution 11 bits +3V V +3.6V, +75C T +95C -1 +1 CC A Temperature Accuracy +3V V +3.6V, +40C T +125C -2 +2 C CC A +3V V +3.6V, -20C T +125C -3 +3 CC A Power-On Reset (POR) Threshold V falling edge 2.0 V CC POR Threshold Hysteresis 90 mV Undervoltage-Lockout Threshold 2.4 V Operating Current During conversion 0.3 0.5 mA Standby Current 36 A Conversion Time t 125 ms CONV Conversion Rate f 8Hz CONV DIGITAL INTERFACE (Note 2) Log i c-Inp ut Hi g h Vol ta ge ( S C L, SD A) V 2.1 V IH Logic-Input Low Voltage (SCL, SDA) V 0.8 V IL Logic-Input Hysteresis (SCL, SDA) 500 mV Leakage C ur r ent ( E V E N T, SC L, SD A, I V = V or V -1 +1 A LEAK IN GND CC A2, A1, A0) Logic-Output Low Voltage V I = 350A 50 mV OL PULL UP (SDA, EVENT) Logic-Output Low Sink Current I V = 0.6V 6 mA OL OL (SDA, EVENT) Input Capacitance (SCL, SDA) C 5pF IN 2 MAX6604