X-On Electronics has gained recognition as a prominent supplier of EPF6016AQC208-3 fpga - field programmable gate array across the USA, India, Europe, Australia, and various other global locations. EPF6016AQC208-3 fpga - field programmable gate array are a product manufactured by Intel. We provide cost-effective solutions for fpga - field programmable gate array, ensuring timely deliveries around the world.

EPF6016AQC208-3

EPF6016AQC208-3 electronic component of Intel
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Part No.EPF6016AQC208-3
Manufacturer: Intel
Category:FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array FPGA - Flex 6000 132 LABs 171 IOs
Datasheet: EPF6016AQC208-3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 34.3417 ea
Line Total: USD 34.34

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
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0 - WHS 1


Ships to you between Fri. 31 May to Thu. 06 Jun

MOQ : 1
Multiples : 1
1 : USD 34.3417

0 - WHS 2


Ships to you between Thu. 06 Jun to Mon. 10 Jun

MOQ : 1
Multiples : 1
1 : USD 34.3417

0 - WHS 3


Ships to you between Fri. 31 May to Thu. 06 Jun

MOQ : 1
Multiples : 1
1 : USD 97.1929
10 : USD 71.9972

     
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FLEX 6000 Programmable Logic Device Family March 2001, ver. 4.1 Data Sheet Provides an ideal low-cost, programmable alternative to high- Features... volume gate array applications and allows fast design changes during prototyping or design testing Product features Register-rich, look-up table- (LUT-) based architecture OptiFLEX architecture that increases device area efficiency Typical gates ranging from 5,000 to 24,000 gates (see Table 1) Built-in low-skew clock distribution tree 100% functional testing of all devices test vectors or scan chains are not required System-level features In-circuit reconfigurability (ICR) via external configuration device or intelligent controller 5.0-V devices are fully compliant with peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic TM MultiVolt I/O interface operation, allowing a device to bridge between systems operating at different voltages Low power consumption (typical specification less than 0.5 mA in standby mode) 3.3-V devices support hot-socketing Table 1. FLEX 6000 Device Features Feature EPF6010A EPF6016 EPF6016A EPF6024A Typical gates (1) 10,000 16,000 16,000 24,000 Logic elements (LEs) 880 1,320 1,320 1,960 Maximum I/O pins 102 204 171 218 Supply voltage (V ) 3.3 V 5.0 V 3.3 V 3.3 V CCINT Note: (1) The embedded IEEE Std. 1149.1 JTAG circuitry adds up to 14,000 gates in addition to the listed typical gates. Altera Corporation 1 A-DS-F6000-04.1FLEX 6000 Programmable Logic Device Family Data Sheet Powerful I/O pins ...and More Individual tri-state output enable control for each pin Features Programmable output slew-rate control to reduce switching noise Fast path from register to I/O pin for fast clock-to-output time Flexible interconnect FastTrack Interconnect continuous routing structure for fast, predictable interconnect delays Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions) Dedicated cascade chain that implements high-speed, high-fan- in logic functions (automatically used by software tools and megafunctions) Tri-state emulation that implements internal tri-state networks Four low-skew global paths for clock, clear, preset, or logic signals Software design support and automatic place-and-route provided by Alteras development system for Windows-based PCs, Sun SPARCstations, and HP 9000 Series 700/800 Flexible package options Available in a variety of packages with 100 to 256 pins, including TM the innovative FineLine BGA packages (see Table 2) TM SameFrame pin-compatibility (with other FLEX 6000 devices) across device densities and pin counts Thin quad flat pack (TQFP), plastic quad flat pack (PQFP), and ball-grid array (BGA) packages (see Table 2) Footprint- and pin-compatibility with other FLEX 6000 devices in the same package Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, the library of parameterized modules (LPM), Verilog HDL, VHDL, DesignWare components, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity, VeriBest, and Viewlogic Table 2. FLEX 6000 Package Options & I/O Pin Count Device 100-Pin 100-Pin 144-Pin 208-Pin 240-Pin 256-Pin 256-pin TQFP FineLine BGA TQFP PQFP PQFP BGA FineLine BGA EPF6010A 71 102 EPF6016 117 171 199 204 EPF6016A 81 81 117 171 171 EPF6024A 117 171 199 218 219 2 Altera Corporation

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ALTERA
Altera (part of the Intel Group)
Altera (VA)
Altera Corporation
INTEL (ALTERA)
Intel (CPU)
Intel (formerly Altera)
Intel / Altera
INTEL / LEVEL ONE

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