Product Information

MCF52277CVM160

MCF52277CVM160 electronic component of NXP

Datasheet
Coldfire V2 MCF5227x Microcontroller IC 32-Bit Single-Core 166.67MHz ROMless 196-MAPBGA (15x15)

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 23.2415 ea
Line Total: USD 23.24

1224 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1224 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1
1 : USD 23.7015
10 : USD 17.181
500 : USD 16.951
2520 : USD 16.5255
5040 : USD 16.422
10080 : USD 16.376

     
Manufacturer
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Maximum Clock Frequency
Maximum Operating Temperature
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Frequency Max
Mounting
Operating Temp Range
Package Type
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Supply Voltage 1 Typ
Operating Temperature Min
Device Core Size
Operating Temperature Classification
Device Core
Instruction Set Architecture
Rad Hardened
Operating Supply Voltage Min
Operating Supply Voltage Max
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Freescale Semiconductor Document Number: MCF52277 Rev. 8, 09/2009 Data Sheet: Technical Data MCF52277 LQFP176 MAPBGA196 24 mm x 24 mm 15mm x 15mm MCF5227x ColdFire Microprocessor Data Sheet Features Version 2 ColdFire Core with EMAC Up to 159 Dhrystone 2.1 MIPS @ 166.67 MHz 8 Kbytes configurable cache (instruction only, data only, or split instruction/data) 128 Kbytes internal SRAM Support for booting from SPI-compatible flash, EEPROM, and FRAM devices Crossbar switch technology (XBS) for concurrent access to peripherals or RAM from multiple bus masters 16 channel DMA controller 16- or 32-bit SDR/DDR controller USB 2.0 On-the-Go controller Liquid crystal display controller with support up to 800 600 pixels ADC and touchscreen controller FlexCAN module 4 32-bit timers with DMA support DMA supported serial peripheral interface (DSPI) 3 UARTs 2 I C bus interface Synchronous serial interface (SSI) Plus-width modulator (PWM) Real-time clock (RTC) Two programmable interrupt controllers (PIT) Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Freescale Semiconductor, Inc., 2009. All rights reserved.Table of Contents 1 MCF5227x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . .4 5.5 Oscillator and PLL Electrical Characteristics. . . . . . . . 19 2 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 5.6 ASP Electrical Characteristics. . . . . . . . . . . . . . . . . . . 20 3 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5 5.7 External Interface Timing Specifications . . . . . . . . . . . 21 3.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 5.7.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.2 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 5.7.2 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.3 ADC Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 5.8 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 29 3.4 Supply Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . .6 5.9 Reset and Configuration Override Timing . . . . . . . . . . 29 3.4.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .6 5.10 LCD Controller Timing Specifications . . . . . . . . . . . . . 30 3.4.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .6 5.11 USB On-The-Go Specifications. . . . . . . . . . . . . . . . . . 33 3.5 Power Consumption Specifications. . . . . . . . . . . . . . . . .7 5.12 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 34 2 4 Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .9 5.13 I C Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 36 4.1 Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 5.14 DMA Timer Timing Specifications . . . . . . . . . . . . . . . . 38 4.2 Pinout176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 5.15 DSPI Timing Specifications . . . . . . . . . . . . . . . . . . . . . 38 4.3 Pinout196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .15 5.16 SBF Timing Specifications. . . . . . . . . . . . . . . . . . . . . . 39 5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 5.17 JTAG and Boundary Scan Timing Specifications . . . . 40 5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 5.18 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 42 5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .17 6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.3 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 7 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .18 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 MCF5227x ColdFire Microprocessor Data Sheet, Rev. 8 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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