MAX20326 Dual Precision Bus Accelerator General Description Benefits and Features The MAX20326 is a dual-channel, precision, open-drain, Reliable Communication communication-line accelerator. It provides the acceleration Wide Operating Input Voltage: +1.4V to +5.5V from a low-to-high transition necessary to allow faster Precision Accelerator Trigger Threshold: 0.5V 50mV data transfer in a highly capacitive, multidrop node system. Fast Charge Up to 1000pF Load Low EMI: Controlled Acceleration Slope 2 The MAX20326 is optimized for the I C bus, as well as 1-Wire bus, where a high-speed, open-drain operation is Space Saving often required with a highly capacitive load. 4-Pin (0.5mm Pitch 1.25mm x 1.25mm Flip-Chip QFN) Integrated Precision Pullup This device is available in a 4-pin 0.5mm pitch 1.25mm x 1.25mm flip-chip QFN package and operates over the -40C to +85C extended temperature range. Ordering Information appears at end of data sheet. Applications 2 I C MDIO 1-Wire Bus 1-Wire is a registered trademark of Maxim Integrated Products, Inc. Functional Diagram V CC MAX20326 CONTROL BLOCK R PU IOVCC R PU IOVCC IOVCCA IOVCCB V THR IOVCC VTHR IOVCC GND 19-100208 Rev 0 12/17MAX20326 Dual Precision Bus Accelerator Absolute Maximum Ratings (All voltages referenced to GND.) Operating Temperature Range ........................... -40C to +85C V ..........................................................................-0.5V to +6V Junction Temperature ......................................................+150C CC IOVCCA, IOVCCB .......................................-0.5V to V + 0.5V Storage Temperature Range ............................ -65C to +150C CC Continuous Current Into Any Terminal ...........................100mA Soldering Temperature (reflow) .......................................+260C Continuous Power Dissipation (T = +70C) A FC QFN (derate 5.15mW/C above +70C) ................412mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 4 FC QFN PACKAGE CODE F41A1F+1 Outline Number 21-100188 Land Pattern Number 90-100054 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 194C/W JA Junction to Case ( ) 84C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com