EVALUATION KIT AVAILABLE MAX15102 Small 2A, Low-Dropout Linear Regulator in a 2.7mm x 1.6mm Package General Description Benefits and Features The MAX15102 is a small, low-dropout linear regulator High-Accuracy LDO Provides Stable Power to optimized for networking, datacom, and server applica- Sensitive Processors tions. The regulator delivers up to 2A from a 1.7V to 5.5V 1.6% Output Accuracy Over Line, Load, and input supply with output accuracy of Q1.6%. The output Temperature is adjustable down to 0.6V with a guaranteed dropout Low Noise 15V (typ) RMS voltage of less than 150mV at full load. The internal 150mV Dropout Guaranteed at 2A p-channel switch is protected with a foldback current limit Small Solution Size Allows More Space for Digital and thermal shutdown. Circuitry The MAX15102 features an external bypass input to 1.6mm x 2.7mm WLP Package reduce noise. This bypass input also serves as a soft- Integrated Thermal-Shutdown Protection start control. An enable input and power-good output are Integrated Foldback Current Protection included for power sequence control. Wide Voltage Ranges Accommodate Low-Voltage The MAX15102 is available in a 1.6mm x 2.7mm WLP POL Requirements package and is fully specified from the -40NC to +105NC Adjustable Output from 0.6V to 5.2V operating temperature range. 1.7V to 5.5V Operating Range Applications Networking Telecom/Datacom Servers Base Stations Ordering Information appears at end of data sheet. PLL Power Typical Operating Circuit INPUT (1.7V TO 5.5V) OUTPUT (0.6V TO V - 200mV) IN IN OUT MAX15102 C C IN OUT R1 2.2F 22F 0 TO 4.6kI EN PG FB POWER-GOOD OUTPUT R2 GND SS BYP 600I C SS 100nF 19-6155 Rev 3 1/17MAX15102 Small 2A, Low-Dropout Linear Regulator in a 2.7mm x 1.6mm Package Absolute Maximum Ratings IN, SS BYP, FB to GND .........................................-0.3V to +6V Operating Temperature Range ...................... -40NC to +105NC Storage Temperature Range ......................... -65NC to +150NC EN, PG, OUT to GND .................................-0.3V to (V + 0.3V) IN OUT Short Circuit ......................................................Continuous Junction Temperature ....................................................+150NC Soldering Temperature (reflow) (Note 1) ........................+260NC Continuous Power Dissipation (T = +70NC) A WLP (derate 19.2mW/NC above +70NC) ....................1538mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: The WLP package is constructed using a unique set of package techniques that impose a limit on the thermal profile. The device can be exposed during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Package Information 15 WLP Package Code W151B2+1 Outline Number 21-0205 Land Pattern Number Refer to Application Note 1891 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) +30C/W JA Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 2 www.maximintegrated.com