NC-559-AS

SMT International, LLC P.O. Box 989 Deep River, CT 06417 AMTECH T oll free: 800.435.0317 Advanced SMT Solder Products P hone: 860.526.8300 Fax: 860.526.8243 www.amtechsolder.com An ISO 9001 Certified Company Product Data Sheet Tacky Paste Flux (TPF) Product Description Stencil Life Touch-up and rework >8 hrs. 20-50% RH & 22-28C Attachment of BGA spheres ~4 hrs. 50-70% RH & 22-28C Soldering Flip Chip components Excellent wetting compatibility Stencil Cleaning Wide reflow window Automated stencil cleaning systems for both stencil and Compatible with most board finishes misprinted boards. Manual cleaning using isopropyl alcohol (IPA) works well. Flux Type Storage and Handling Procedures AMTECH Tacky Paste Flux Type Class Refrigerated storage at 4247F will prolong Tacky Paste Fluxs SynTECH-TPF N/C ROLO shelf life to no less than 1 year. Syringes & cartridges should be SynTECH-LF-TPF N/C for LF ROLO stored vertically with the dispensing tip down. Tacky Paste Flux should be allowed to reach ambient temperature naturally, NC-559-TPF N/C ROLO prior to use (about 6-8 hours). NEVER FREEZE TACKY LF-4300-TPF N/C & W/S RELO PASTE FLUX. 4300-TPF N/C & W/S RELO NC-559-ASM-TPF N/C ROLO Available Packaging NC-560-TPF N/C ROLO Standard packaging for stencil printing and dispensing applications include: NWS-4100-TPF W/S REMO 75 & 150 gram jars NWS-4200-TPF W/S REMO 150 gram cartridges NWS-4200-4-TPF W/S REHO 10cc & 30cc syringes NWS-4200-6-TPF W/S REH1 (continued) NWS-4200-LF-TPF W/S for LF REH1 RMA-223-TPF RMA ROLO RMA-223-LF-TPF RMA for LF ROMO RA-223 RA ROHO Tacky Paste Flux (TPF) SMT International, LLC Tacky Paste Flux (TPF) P.O. Box 989 Deep River, CT 06417 Toll free: 800.435.0317 Phone: 860.526.8300 Fax: 860.526.8243 www.amtechsolder.com Recommended Profiles: Ramp Profile Profile-A for Sn62 & Sn63 alloy Topside temperature of board to be 205-220C Profile-A was designed to serve as a 250 starting point for process optimization 220 200 Liquidus Temperature for Sn62 & Sn63 alloys using Tacky Paste Flux. A cool down rate 183 Reflow Time: of (-) 24C/second is ideal for the 30-60 Sec. Flux Activation Temperature 150 RAMP < 1.0C/Second formation of a fine grain structure Soaking Zone without risking damage to thermally 100 Soak Temp 140-180C sensitive components. This profile is Soak Time 60-90 Sec 50 recommended when soldering Sn63 or Pre-heat 1 Pre-heat 2 Reflow Zone Cooling Sn62 alloys. 0 0 30 60 90 120 150 180 210 240 270 300 Time (Sec.) Profile-B was designed to serve as a Profile-B for Sn96.5/Ag3.0/Cu.5 and Sn96.5/Ag3.5 alloys starting point for process optimization 300 using Tacky Paste Flux. A cool down Peak Temperature (Min 230CMax 249C) 250 rate of (-) 2 - 4C/second is ideal for the Liquidus Temperature 219 formation of a fine grain structure with- 200 Reflow Time: out risking damage to thermally sensitive Flux Activation Temperature 30-60 Sec. 150 components. This profile is recommended RAMP < 2.0C/Second Soaking Zone when soldering Sn96.5/Ag3.0/Cu.5 or 100 Sn96.5/Ag3.5 alloys. Soak Temp 140-200C 50 Soak Time 60-90 Sec Pre-heat 1 Pre-heat 2 Reflow Zone Cooling 0 0 30 60 90 120 150 180 210 240 270 300 330 Time (Sec.) The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Users of our products should make their own tests to determine the suitability of each product for their particular process. AMTECH will assume no liability for results obtained or damages incurred through the application of the data presented. Rev: 08/13 AMTECH Advanced SMT Solder Products FILLING THE V OID Temp. (C) Temp. (C)