X-On Electronics has gained recognition as a prominent supplier of W25Q257JVFIQ nor flash across the USA, India, Europe, Australia, and various other global locations. W25Q257JVFIQ nor flash are a product manufactured by Winbond. We provide cost-effective solutions for nor flash, ensuring timely deliveries around the world.

W25Q257JVFIQ

W25Q257JVFIQ electronic component of Winbond
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Part No.W25Q257JVFIQ
Manufacturer: Winbond
Category:NOR Flash
Description: NOR Flash spiFlash, 3V, 256M-bit, 4Kb Uniform Sector, 4-Byte (default) / 3-Byte Address Modes
Datasheet: W25Q257JVFIQ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.7879 ea
Line Total: USD 3.79

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 44
Multiples : 1
44 : USD 4.2884
220 : USD 4.1335
440 : USD 4.1222
1100 : USD 4.0743
2640 : USD 4.0306

0 - WHS 2


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 220
Multiples : 220
220 : USD 3.3642
440 : USD 3.3012
1100 : USD 3.213
2640 : USD 3.213
5060 : USD 3.1752

     
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We proudly offer the W25Q257JVFIQ NOR Flash at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the W25Q257JVFIQ NOR Flash.

W25Q257JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: May 03, 2017 Revision B W25Q257JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 (1) 4.6 Reset (/RESET) ................................................................................................................. 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI Operations ................................................................................................................... 10 6.1.1 Standard SPI Instructions ..................................................................................................... 10 6.1.2 Dual SPI Instructions ............................................................................................................ 10 6.1.3 Quad SPI Instructions ........................................................................................................... 10 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 7.1.1 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.2 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 17 7.1.4 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 17 7.1.5 Current Address Mode (ADS) Status Only ..................................................................... 18 7.1.6 Power-Up Address Mode (ADP) Non-Volatile Writable .................................................. 18 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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