X-On Electronics has gained recognition as a prominent supplier of W25Q32FVSSIG nor flash across the USA, India, Europe, Australia, and various other global locations. W25Q32FVSSIG nor flash are a product manufactured by Winbond. We provide cost-effective solutions for nor flash, ensuring timely deliveries around the world.

W25Q32FVSSIG

W25Q32FVSSIG electronic component of Winbond
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Part No.W25Q32FVSSIG
Manufacturer: Winbond
Category:NOR Flash
Description: NOR Flash Serial-SPI 3V/3.3V 32M-bit 4M x 8 8.5ns 8-Pin SOIC
Datasheet: W25Q32FVSSIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

90: USD 0.8521 ea
Line Total: USD 76.69

Availability - 0
MOQ: 90  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 90
Multiples : 1
90 : USD 0.8521

     
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We proudly offer the W25Q32FVSSIG NOR Flash at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the W25Q32FVSSIG NOR Flash.

W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: OCtober 15, 2012 Revision D W25Q32FV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil .................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm ...................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 3.8 Pin Configuration PDIP 300-mil ............................................................................................ 9 3.9 Pin Description PDIP 300-mil ............................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 10 4.3 Write Protect (/WP) ............................................................................................................ 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 4.6 Reset (/RESET) .................................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 SPI / QPI Operations .......................................................................................................... 12 6.1.1 Standard SPI Instructions ..................................................................................................... 12 6.1.2 Dual SPI Instructions ............................................................................................................ 12 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 QPI Instructions .................................................................................................................... 13 6.1.5 Hold Function ....................................................................................................................... 13 6.1.6 Software Reset & Hardware /RESET pin .............................................................................. 14 6.2 Write Protection .................................................................................................................. 15 6.2.1 Write Protect Features ......................................................................................................... 15 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 16 7.1 Status Registers ................................................................................................................. 16 7.1.1 Erase/Write In Progress (BUSY) Status Only .................................................................... 16 7.1.2 Write Enable Latch (WEL) Status Only ............................................................................. 16 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................... 16 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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