Product Information

W25Q256JVBIQ

W25Q256JVBIQ electronic component of Winbond

Datasheet
NOR Flash spiFlash, 3V, 256M-bit, 4Kb Uniform Sector
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.1979 ea
Line Total: USD 1.2

1 - Global Stock
Ships to you between
Fri. 03 May to Thu. 09 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
1 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1

Stock Image

W25Q256JVBIQ
Winbond

1 : USD 1.1979

1257 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1

Stock Image

W25Q256JVBIQ
Winbond

1 : USD 2.8731
10 : USD 2.8166
100 : USD 2.6906
250 : USD 2.6644
480 : USD 2.5344
960 : USD 2.4838
2880 : USD 2.4838
5280 : USD 2.4838

1149 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

Stock Image

W25Q256JVBIQ
Winbond

1 : USD 3.5742
10 : USD 3.2723
100 : USD 2.9342
250 : USD 2.9222
480 : USD 2.8135
960 : USD 2.729
2880 : USD 2.5961
5280 : USD 2.5116
10080 : USD 2.4633

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Hts Code
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Additional Infomation About Product

W25Q256JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: August 03, 2017 Revision G W25Q256JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 (1) 4.6 Reset (/RESET) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI Operations ................................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 7.1.1 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.2 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 17 7.1.4 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 17 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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