P8X32A-D40

Propeller P8X32A Datasheet 8-Cog Multiprocessor Microcontroller 1.0 PRODUCT OVERVIEW 1.1. Introduction The Propeller chip is designed to provide high-speed processing for embedded systems while maintaining low current consumption and a small physical footprint. In addition to being fast, the Propeller chip provides flexibility and power through its eight processors, called cogs, that can perform simultaneous tasks independently or cooperatively, all while maintaining a relatively simple architecture that is easy to learn and utilize. Two programming languages are available: Spin (a high-level object-based language) and Propeller Assembly. Both include custom commands to easily manage the Propeller chips unique features. Figure 1: Propeller P8X32A Block Diagram 1.2. Stock Codes Table 1: Propeller Chip Stock Codes External Internal Device Power I/O Internal RC Global Package Type Clock Execution Cog RAM Pins Oscillator ROM/RAM Stock Requirements Speed Speed P8X32A-D40 40-pin DIP 64 K bytes 32 DC to 80 12 MHz or 0 to 160 MIPS 32768 bytes 512 x 32 bits P8X32A-Q44 44-pin LQFP 3.3 volts DC CMOS MHz 20 kHz* (20 MIPS/cog) per cog ROM / 32768 bytes RAM P8X32A-M44 44-pin QFN *Approximate may range from 8 MHz 20 MHz, or 13 kHz 33 kHz, respectively. Propeller P8X32A Datasheet Page 1 of 36 Rev 1.4 6/14/2011 Propeller P8X32A Datasheet www.parallaxsemiconductor.com Table of Contents 5.2. Cog RAM................................................................................. 16 1.0 Product Overview......................................................... 1 1.1. Introduction ................................................................................1 6.0 Programming Languages ..........................................17 1.2. Stock Codes...............................................................................1 6.1. Reserved Word List ................................................................. 17 1.3. Key Features and Benefits.........................................................3 6.1.1. Words Reserved for Future Use ......................................................... 17 1.3.1. 32-bit Multicore Architecture..................................................................3 6.2. Math and Logic Operators ....................................................... 18 1.3.2. Clock System and Wait Instructions......................................................3 6.3. Spin Language Summary Table .............................................. 19 1.3.3. Programming Languages and Resources .............................................3 6.3.1. Constants ........................................................................................... 21 1.3.4. Flexible I/O and Peripheral Interface.....................................................3 6.4. Propeller Assembly Instruction Table....................................... 22 1.4. Applications................................................................................3 6.4.1. Assembly Conditions .......................................................................... 24 1.4.1. Corporate and Community Support.......................................................3 6.4.2. Assembly Directives ........................................................................... 24 6.4.3. Assembly Effects ................................................................................ 24 2.0 Connection Diagrams .................................................. 4 6.4.4. Assembly Operators ........................................................................... 24 2.1. Pin Assignments ........................................................................4 2.2. Pin Descriptions .........................................................................4 7.0 Electrical Characteristics...........................................25 2.3. Typical Connection Diagrams ....................................................5 7.1. Absolute Maximum Ratings ..................................................... 25 2.3.1. Propeller Clip or Propeller Plug Connection - Recommended...............5 7.2. DC Characteristics................................................................... 25 2.3.2. Alternative Serial Port Connection.........................................................5 7.3. AC Characteristics................................................................... 25 3.0 Operating Procedures ................................................. 6 8.0 Current Consumption Characteristics .....................26 3.1. Boot-Up Procedure ....................................................................6 8.1. Typical Current Consumption of 8 Cogs .................................. 26 3.2. Run-Time Procedure..................................................................6 8.2. Typical Current of a Cog vs. Operating Frequency .................. 27 3.3. Shutdown Procedure..................................................................6 8.3. Typical PLL Current vs. VCO Frequency ................................. 27 8.4. Typical Crystal Drive Current ................................................... 28 4.0 System Organization ................................................... 6 8.5. Cog and I/O Pin Relationship................................................... 28 4.1. Shared Resources .....................................................................6 8.6. Current Profile at Various Startup Conditions .......................... 29 4.2. System Clock.............................................................................6 4.3. Cogs (processors)......................................................................7 9.0 Temperature Characteristics.....................................30 4.4. Hub ............................................................................................7 9.1. Internal Oscillator Frequency as a Function of Temperature.... 30 4.5. I/O Pins......................................................................................8 9.2. Fastest Operating Frequency as a Function of Temperature ... 31 4.6. System Counter .........................................................................8 9.3. Current Consumption as a Function of Temperature ............... 32 4.7. Locks .........................................................................................8 4.8. Assembly Instruction Execution Stages .....................................9 10.0 Package Dimensions..................................................33 4.9. Cog Counters...........................................................................10 10.1. P8X32A-D40 (40-pin DIP)........................................................ 33 4.9.1. CTRA / CTRB Control register .........................................................10 10.2. P8X32A-Q44 (44-pin LQFP).................................................... 34 4.9.2. FRQA / FRQB Frequency register....................................................10 10.3. P8X32A-M44 (44-pin QFN)...................................................... 35 4.9.3. PHSA / PHSB Phase register...........................................................10 4.10. Video Generator.......................................................................11 11.0 Manufacturing Info .....................................................36 4.10.1. VCFG Video Configuration Register.................................................11 11.1. Reflow Peak Temperature ....................................................... 36 4.10.2. VSCL Video Scale Register..............................................................12 4.10.3. WAITVID Command/Instruction ..........................................................12 11.2. Green/RoHS Compliance ........................................................ 36 4.11. CLK Register............................................................................14 12.0 Revision History .........................................................36 12.1.1. Changes for Version 1.1:.................................................................... 36 5.0 Memory Organization ................................................ 15 12.1.2. Changes for Version 1.2:.................................................................... 36 5.1. Main Memory ...........................................................................15 12.1.3. Changes for Version 1.3..................................................................... 36 5.1.1. Main RAM............................................................................................15 12.1.4. Changes for Version 1.4..................................................................... 36 5.1.2. Main ROM ...........................................................................................15 5.1.3. Character Definitions...........................................................................15 5.1.4. Math Function Tables..........................................................................16 Copyright Parallax Inc., dba Parallax Semiconductor Page 2 of 36 Rev 1.4 6/14/2011