Product Information

88W8801-B0-NMDE/AK

88W8801-B0-NMDE/AK electronic component of NXP

Datasheet
RF System on a Chip - SoC MVL

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

490: USD 4.5505 ea
Line Total: USD 2229.75

0 - Global Stock
MOQ: 490  Multiples: 379
Pack Size: 379
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 490
Multiples : 490
490 : USD 4.442

     
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88W8801_SDS 2.4 GHz Single-band 1x1 Wi-Fi 4 Solution Rev. 2 14 December 2020 Product short data sheet 1 Product overview The 88W8801 is a highly integrated, single-band (2.4 GHz) IEEE 802.11n 1x1 System- on-Chip (SoC), specifically designed to support High Throughput (HT) data rates for Wi- Fi products. The device provides the combined functions of Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency Division Multiplexing (OFDM) baseband modulation, Medium Access Controller (MAC), CPU, memory, host interfaces, and direct conversion Wi-Fi RF radio on a single integrated chip. For security, the 802.11i security standard is supported through several protocols. And for video, voice, and multimedia applications, 802.11e Quality of Service (QoS) is supported. Host interfaces include USB 2.0 and SDIO 2.0 to connect the Wi-Fi radio to the host processor. The device is available in a 48-pin QFN package. Figure 1 shows the application block diagram of the device. Wi-Fi 88W8801 Antenna SDIO Interface Wi-Fi 2.4 GHz USB 2.0 Interface GPIO Interface 3.3V and 1.8V Power-Down XTAL_IN XTAL_OUT Figure 1.Application block diagramNXP Semiconductors 88W8801_SDS 2.4 GHz Single-band 1x1 Wi-Fi 4 Solution 1.1 Applications Internet of Things Imaging platforms (printers, digital still cameras, digital picture frames) Consumer electronic devices Smart Energy systems Connected appliances 1.2 Wi-Fi key features 1x1 SISO and HT20 operation 802.11e Quality of Service (QoS) Thick MAC architecture Simultaneous operation Mobile AP and STA Wi-Fi direct and STA Supports WPA2/WPA2 mixed mode and WPA3 security standards 1.3 Host interfaces USB 2.0 with Link Power Management (LPM) SDIO 2.0 1.4 Operating characteristics Supply voltage: 1.8V and 3.3V Operating temperature Commercial: 0 to 70C Extended: -30 to 85C Industrial: -40 to 85C 1.5 General features Package: 48-pin QFN (6 mm x 6 mm) 26 MHz and 38.4 MHz crystal clock support Supports CMOS and low-swing sine wave input clock Low-power operation supporting deep-sleep and standby modes ARM-based CPU 128 MHz maximum CPU clock speed Peripheral interfaces: Clocked serial unit: 2-Wire serial interface UART (debug) interface General Purpose Input Output (GPIO) Memory Internal SRAM Boot ROM One Time Programmable (OTP) memory for storing the MAC address and calibration data 88W8801_SDS All information provided in this document is subject to legal disclaimers. NXP B.V. 2020. All rights reserved. Product short data sheet Rev. 2 14 December 2020 2 / 57

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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