256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM Features Mobile Low-Power SDR SDRAM MT48H16M16LF 4 Meg x 16 x 4 banks MT48H8M32LF 2 Meg x 32 x 4 banks Options Marking Features V /V : 1.8V/1.8V H DD DDQ V /V = 1.71.95V DD DDQ Addressing Fully synchronous all signals registered on positive Standard addressing option LF edge of system clock Configuration Internal, pipelined operation column address can 16 Meg x 16 (4 Meg x 16 x 4 banks) 16M16 be changed every clock cycle 8 Meg x 32 (2 Meg x 32 x 4 banks) 8M32 Plastic green packages Four internal banks for concurrent operation 1 54-ball VFBGA (8mm x 9mm) BF Programmable burst lengths: 1, 2, 4, 8, and continu- 2 90-ball VFBGA (8mm x 13mm) B5 ous Timing cycle time Auto precharge, includes concurrent auto precharge 6ns CL = 3 -6 Auto refresh and self refresh modes 7.5ns CL = 3 -75 LVTTL-compatible inputs and outputs Operating temperature range On-chip temperature sensor to control self refresh Commercial (0C to +70C) None rate Industrial (40C to +85C) IT Revision :H Partial-array self refresh (PASR) Deep power-down (DPD) 1. Available only for x16 configuration. Notes: Selectable output drive strength (DS) 2. Available only for x32 configuration. 64ms refresh period Table 1: Configuration Addressing Architecture 16 Meg x 16 8 Meg x 32 Number of banks 4 4 Bank address balls BA0, BA1 BA0, BA1 Row address balls A 12:0 A 11:0 Column address balls A 8:0 A 8:0 Table 2: Key Timing Parameters Clock Rate (MHz) Access Time Speed Grade CL = 2 CL = 3 CL = 2 CL = 3 -6 104 166 8.0ns 5.0ns -75 104 133 8.0ns 5.4ns Note: 1. CL = CAS (READ) latency PDF: 09005aef834c13d2 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 256mb mobile sdram y36n.pdf - Rev. J 09/10 EN 2008 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM Features Figure 1: 256Mb Mobile LPSDR Part Numbering MT 48 H 16M16 LF BF -6 IT :H Micron Technology Revision :H Product Family 48 = Mobile SDR SDRAM Operating Temperature Blank = Commercial (0C to +70C) Operating Voltage IT = Industrial (40C to +85C) H = 1.8V/1.8V Cycle Time t Configuration -6 = 6ns CK, CL = 3 t 16 Meg x 16 -75 = 7.5ns CK, CL = 3 8 Meg x 32 Package Codes Addressing BF = 8mm x 9mm VFBGA green LF = Mobile standard addressing B5 = 8mm x 13mm VFBGA green FBGA Part Marking Decoder Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Microns FBGA part marking decoder is available at www.micron.com/decoder. PDF: 09005aef834c13d2 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 256mb mobile sdram y36n.pdf - Rev. J 09/10 EN 2008 Micron Technology, Inc. All rights reserved.