VA10800-PQ12803PCA

VA10800 VA10800 6.4.2 Leakage Current non-I2C pads 24 Table of Contents 6.4.3 VOL, VOH non-I2C pads ....... 24 6.4.4 I2C Pads .................................. 25 1 Functional Description ....................... 4 6.4.5 Input Leakage Current and 1.1 Related Documentation ................... 4 Output Voltage I2C Pads ...................... 25 1.2 Feature Summary ............................. 4 6.5 DC Operating Current 1.3 Power-Up Sequence ......................... 8 Consumption .............................................. 26 1.4 Power-Up and Reset Behavior of 6.5.1 Typical Operating Current pins 8 Curves 27 1.5 Other Resets ..................................... 8 6.6 DC Standby Current Consumption 1.6 Support for in system programming 28 of the SPI ROM ............................................ 9 2 6.7 Internal Weak Pull-up/Pull-down.. 28 1.7 I C pins .............................................. 9 6.8 128 pin QFP Pin Capacitance ...... 29 1.8 eFuse Writing ................................. 10 7 AC Electrical Characteristics ........... 30 2 Block Diagram ................................. 11 7.1 AC Timing Conditions .................... 30 3 Pin Descriptions ................................ 12 7.1.1 Output delay derating for loads 30 4 Package Options ............................. 14 7.2 Internal Nominal 1 MHz Oscillator 4.1 128 Pin Plastic LQFP ...................... 14 31 4.2 128 Pin Ceramic LQFP .................. 15 7.3 Clock Signal .................................... 31 5 Die Options ...................................... 16 7.4 GPIO PORTA/PORTB..................... 31 2 5.1 Table of Die Pad Coordinates from 7.5 I C pins ............................................ 32 Center of Die in Microns .......................... 16 2 7.5.1 I C Pin Timing ............................... 34 5.2 Pad Layout with Marking in Upper 7.6 SPI ROM.......................................... 35 Left Corner of Die ...................................... 20 7.7 JTAG ................................................ 37 6 Ratings Tables .................................. 21 8 Thermal Characteristics ................... 38 6.1 Absolute Maximum Ratings .......... 21 9 Electrostatic Discharge (ESD) 6.2 Recommended Supply Operating Protection Charcteristics ......................... 39 Condition .................................................... 21 6.3 Recommended Supply Conditions 10 Package Mechanical Information 21 40 6.4 Signal Pads Operating Conditions 10.1 128 Pin Plastic LQFP Nominal 23 Package Dimensions (mm) ....................... 40 2 6.4.1 Non- I C Pads .......................... 23 www.voragotech.com Rev2.1 page 1 VA10800 VA10800 10.2 128 Pin Ceramic LQFP Nominal Package Dimensions (mm) ....................... 41 11 Ordering Information .................. 42 9.1 Part Marking ....................................... 42 12 Development kit Ordering Information .............................................. 42 13 Errata ............................................. 43 14 Revision History ............................ 44 www.voragotech.com Rev2.1 page 2