GP1S092HCPIF

GP1S092HCPIF SMT, Gap : 2mm, Slit : 0.3mm GP1S092HCPIF Phototransistor Output, Compact Transmissive Photointerrupter Description Agency approvals/Compliance GP1S092HCPIF is a compact-package, photo- 1. Compliant with RoHS directive transistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides Applications non-contact sensing. The compact package series is 1. General purpose detection of object presence or a result of unique technology combing transfer and motion. injection molding. 2. Example: printer, lens control for camera This surface mount device has a shaped positioning pin to assure accurate PCB placement, of the emitter and detector. It is unique, because it is one of the few photointerrupters that comes in Tape and Reel packaging, for use with highly automated pick and place equipment. Features 1. Transmissive with phototransistor output 2. Highlights: Compact Size Positioning Pin D shaped to prevent misalignment Surface Mount Type (SMT) Tape and Reel (T&R) 2 000 pcs per reel 3. Key Parameters: Gap Width : 2mm Slit Width (detector side): 0.3mm Package : 4.52.62.9 mm 4. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of con rmation by device speci cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speci cation sheets before using any SHARP device. Sheet No.: D3-A00201FEN 1 Date Oct. 3. 2005 SHARP CorporationGP1S092HCPIF Internal Connection Diagram Top view 2 1 1 Anode 2 Collector 3 Emitter 4 Cathode 3 4 Outline Dimensions (Unit : mm) Top view MAX. 1.2 (C0.3) a-a section 0.1 4.5 (0.3) 0.1 2.6 +0.2 Slit width 2 0.1 (C0.4) Center of light path Date code (C0.3) +0.1 0.5 0.4 0.2 3.4 *2 0.1 R0.6 Unspeci ed tolerance shall be 0.2mm 3 4 Dimensions in parenthesis are shown for reference The dimensions indicated by refer to those measured from the lead base The dimensions shown do not include those of burrs 2 1 Leads coplanarity 0.05 1.2 Difference of distance between package bottom and bottom side of each shall be MAX. 0.1mm Coplanarity of the boss and gap of the device shall be 0.1mm portion : No solder plating The marking speci cations are shown below Product mass : approx. 0.05g Plating material : SnCu (Cu : TYP. 2%) Details of positioning pin dimensions (Unit : mm) 30 0.2 (0.08) 0.05 1.2 0.1 30 R0.6 0.2 Sheet No.: D3-A00201FEN 2 Package bottom 0.1 0.7 0.05 0.05 1 1 +0.1 (0.35) 0.05 (0.75) 0.05 0.4 0.4 0.2 a a 0.8 0.05 21 (0.08) 0.8 0.1 2.9 0.2