Product Information

ISL33001IRTZ

ISL33001IRTZ electronic component of Renesas

Datasheet
Intersil Interface - Signal Buffers, Repeaters WANNEAL VIS25 8INCH I2C BUFR IND(-40 T

Manufacturer: Renesas
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.3 ea
Line Total: USD 2.3

6756 - Global Stock
Ships to you between
Thu. 02 May to Mon. 06 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
6724 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1

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ISL33001IRTZ
Renesas

1 : USD 2.254
10 : USD 1.932
100 : USD 1.6905
200 : USD 1.587
500 : USD 1.426
1000 : USD 1.219
2000 : USD 1.173
5000 : USD 1.173
10000 : USD 1.1615

     
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RoHS - XON
Icon ROHS
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Maximum Operating Temperature
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Mxhts
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DATASHEET ISL33001, ISL33002, ISL33003 FN7560 Rev 6.00 I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability July 11, 2014 The ISL33001, ISL33002, ISL33003 are 2-Channel Bus Buffers Features that provide the buffering necessary to extend the bus 2 2 2 Channel I C compatible bi-directional buffer capacitance beyond the 400pF maximum specified by the I C specification. In addition, the ISL33001, ISL33002, ISL33003 +2.3VDC to +5.5VDC supply range feature rise time accelerator circuitry to reduce power >400kHz operation consumption from passive bus pull-up resistors and improve Bus capacitance buffering data-rate performance. All devices also include hot swap circuitry 2 to prevent corruption of the data and clock lines when I C devices Rise time accelerators are plugged into a live backplane, and the ISL33002 and Hot swapping capability ISL33003 add level translation for mixed supply voltage applications. The ISL33001, ISL33002, ISL33003 operate at 6kV Class 3 HBM ESD protection on all pins supply voltages from +2.3V to +5.5V at a temperature range of 12kV HBM ESD protection on SDA/SCL pins -40C to +85C. Enable pin (ISL33001 and ISL33003) Summary of Features Logic level translation (ISL33002 and ISL33003) PART LEVEL ENABLE READY ACCELERATOR READY logic pin (ISL33001) NUMBER TRANSLATION PIN PIN DISABLE Accelerator disable pin (ISL33002) ISL33001 No Yes Yes No Pb-free (RoHS Compliant) 8 Ld SOIC (ISL33001 only), ISL33002 Yes No No Yes 8 Ld TDFN (3mmx3mm) and 8 Ld MSOP packages ISL33003 Yes Yes No No Low quiescent current . 2.1mA typ Low shutdown current 0.5A typ Related Literature Applications AN1543, ISL33001MSOPEVAL1Z, ISL33002MSOPEVAL1Z, 2 ISL33003MSOPEVAL1Z Evaluation Board Users Manual I C bus extender and capacitance buffering 2 AN1637, Level Shifting Between 1.8V and 3.3V Using I C Server racks for telecom, datacom, and computer servers Buffers Desktop computers Hot-swap board insertion and bus isolation 2 100kHz I C BUS WITH 2.7k PULL-UP RESISTOR AND 400pF BUS CAPACITANCE V +3.3V +5.0V V CC1 CC2 WITHOUT BUFFER C BACK PLANE SDA 2 I C SDA ISL33003 SCL DEVICE SCL A EN WITH BUFFER 2 I C DEVICE B GND TIME (2s/DIV) FIGURE 1. TYPICAL OPERATING CIRCUIT FIGURE 2. BUS ACCELERATOR PERFORMANCE FN7560 Rev 6.00 Page 1 of 18 July 11, 2014 VOLTAGE (1V/DIV)ISL33001, ISL33002, ISL33003 Ordering Information PART NUMBER PART TEMP. RANGE PACKAGE PKG. (Notes 1, 2, 3) MARKING (C) (Pb-free) DWG. ISL33001IRTZ 3001 -40 to +85 8 Ld TDFN (0.65mm Pitch) L8.3x3A ISL33001IRT2Z 01R2 -40 to +85 8 Ld TDFN (0.5mm Pitch) L8.3x3H ISL33001IBZ 33001 IBZ -40 to +85 8 Ld SOIC M8.15 ISL33001IUZ 33001 -40 to +85 8 Ld MSOP M8.118 ISL33002IRTZ 3002 -40 to +85 8 Ld TDFN (0.65mm Pitch) L8.3x3A ISL33002IRT2Z 02R2 -40 to +85 8 Ld TDFN (0.5mm Pitch) L8.3x3H ISL33002IUZ 33002 -40 to +85 8 Ld MSOP M8.118 ISL33003IRTZ 3003 -40 to +85 8 Ld TDFN (0.65mm Pitch) L8.3x3A ISL33003IRT2Z 03R2 -40 to +85 8 Ld TDFN (0.5mm Pitch) L8.3x3H ISL33003IUZ 33003 -40 to +85 8 Ld MSOP M8.118 ISL33001MSOPEVAL1Z ISL33001 Evaluation Board ISL33002MSOPEVAL1Z ISL33002 Evaluation Board ISL33003MSOPEVAL1Z ISL33003 Evaluation Board NOTES: 1. Add -T* suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL33001, ISL33002, ISL33003. For more information on MSL please see techbrief TB363. Pin Configurations ISL33001 ISL33001 (8 LD TDFN) (8 LD SOIC, MSOP) TOP VIEW TOP VIEW V EN CC1 1 8 V EN 1 8 CC1 SCL OUT 2 7 SDA OUT 2 SCL OUT 7 SDA OUT PAD 6 SCL IN 3 SDA IN 3 6 SCL IN SDA IN GND 4 5 READY GND 4 5 READY ISL33002 ISL33002 (8 LD TDFN) (8 LD MSOP) TOP VIEW TOP VIEW V V V V CC2 1 8 CC1 CC2 1 8 CC1 SCL OUT SCL OUT SDA OUT 2 7 SDA OUT 2 7 PAD SCL IN 3 SCL IN 3 6 SDA IN 6 SDA IN GND 5 GND 4 5 ACC 4 ACC FN7560 Rev 6.00 Page 2 of 18 July 11, 2014

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
CEL (RENESAS)
ID4
IDT
IDT, Integrated Device Technology Inc
INTEGRATED DEVICE
INTEGRATED DEVICE TECHNOLOGY
INTEGRATED DEVICES TECH AID
Intersil
INTERSIL - FGC
Intersil(Renes as Electronics)
Intersil(Renesas Electronics)
ITS
REA
RENESAS
RENESAS (IDT)
RENESAS (INTERSIL)
Renesas / IDT
Renesas / Intersil
Renesas Electronics
Renesas Electronics America
RENESAS TECHNOLOGY

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