ENW-89837A3KF

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-1026-2400-102 1.4 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 1 of 37 SPP MODULE CUSTOMERS CODE PANASONICS CODE DATE 04.05.2015 PAN1026 ENW89837AxKF Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer TOSHIBA Electronics Europe GmbH Software Hansaallee 181 40549 Dsseldorf Germany Software Version Please refer to chapter 20 / 21 By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-1026-2400-102 1.4 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 2 of 37 SPP MODULE CUSTOMERS CODE PANASONICS CODE DATE 04.05.2015 PAN1026 ENW89837AxKF TABLE OF CONTENTS 1 Scope of this Document ................................................................................................ 4 2 Key Features ................................................................................................................. 4 3 Bluetooth Low Energy ................................................................................................... 5 4 Applications for the Module ........................................................................................... 5 5 Description for the Module ............................................................................................. 5 6 Detailed Description ...................................................................................................... 6 6.1 PAN1026 Terminal Layout ................................................................................... 6 6.2 PAN1026 Terminal Description ............................................................................ 6 6.3 UART Interface .................................................................................................... 8 6.3.1 Features .................................................................................................. 8 6.3.2 Connection Example ............................................................................... 9 6.3.3 Frame Format ....................................................................................... 10 6.3.4 Flow Control Function ........................................................................... 10 6.3.5 UART Baud Rate Setting ...................................................................... 10 6.3.6 Error Detect Function ............................................................................ 11 7 Bluetooth Features ...................................................................................................... 12 8 Block Diagram ............................................................................................................. 12 9 Test Conditions ........................................................................................................... 13 10 General Device Requirements and Operation ............................................................. 13 10.1 Absolute Maximum Ratings ................................................................................ 13 10.2 Recommended Operating Conditions ................................................................. 13 10.3 Current Consumption ......................................................................................... 14 11 Bluetooth RF Performance .......................................................................................... 15 11.1 Bluetooth Characteristics ................................................................................... 15 12 Soldering Temperature-Time Profile (for reflow soldering) ........................................... 16 13 Module Dimension....................................................................................................... 17 14 PAN1026 FootPrint of the Module ............................................................................... 18 15 Case Marking .............................................................................................................. 19 15.1 Example for Marking .......................................................................................... 19 15.2 Marking Definition .............................................................................................. 19 16 Mechanical Requirements ........................................................................................... 19 17 Reliability Tests ........................................................................................................... 20 18 Cautions ...................................................................................................................... 20 18.1 Design Notes ..................................................................................................... 20 18.2 Installation Notes ................................................................................................ 21 18.3 Usage Conditions Notes ..................................................................................... 21 18.4 Storage Notes .................................................................................................... 22 18.5 Safety Cautions .................................................................................................. 22 18.6 Other cautions .................................................................................................... 22 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de