Product Information

LV8548MCZ-AH

LV8548MCZ-AH electronic component of ON Semiconductor

Datasheet
Forward/Reverse Motor Driver 10-Pin SOIC N

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

169: USD 2.5685 ea
Line Total: USD 434.08

0 - Global Stock
MOQ: 169  Multiples: 169
Pack Size: 169
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 26 Apr to Thu. 02 May

MOQ : 169
Multiples : 169

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LV8548MCZ-AH
ON Semiconductor

169 : USD 2.5685

0 - Global Stock


Ships to you between Fri. 26 Apr to Thu. 02 May

MOQ : 2500
Multiples : 2500

Stock Image

LV8548MCZ-AH
ON Semiconductor

2500 : USD 2.8319

     
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Ordering number : ENA2038C LV8548MC Monolithic Linear IC LV8548MC Electrical Characteristics at Ta = 25 C, V = 12V CC Ratings Parameter Symbol Conditions Unit min typ max Power supply voltage I0 Standby mode 1 A CC IN1=IN2=IN3=IN4=LOW I 1 It isHig from IN1 as for either of IN4. 1.7 2.3 mA CC Load opening Input current I V=5V 3550 65 A IN IN Thermal shutdown operating Ttsd Design certification 150 180 210 C temperature Width of temperature hysteria Ttsd Design certification 40 C Low voltage protection function VthV 3.3 3.5 3.65 V CC operation voltage Release voltage Vthret 3.55 3.8 3.95V Output ON resistance R I=1.0A 0.71 1.25 ON OUT (Upper and lower total) Output leak current Ileak V=16V 10 A O O Diode forward voltage VD ID=1.0A 1.0 1.2 V Package Dimensions SOIC-10NB CASE 751BQ-01 ISSUE A 2X NOTES: 0.10 C A-B 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. D 2. CONTROLLING DIMENSION: MILLIMETERS. D 3. DIMENSION b DOES NOT INCLUDE DAMBAR A PROTRUSION. ALLOWABLE PROTRUSION 2X SHALL BE 0.10mm TOTAL IN EXCESS OF b AT MAXIMUM MATERIAL CONDITION. 0.10 C A-B F 4. DIMENSIONS D AND E DO NOT INCLUDE 10 6 MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm H E PER SIDE. DIMENSIONS D AND E ARE DE- TERMINED AT DATUM F. 1 5. DIMENSIONS A AND B ARE TO BE DETERM- 5 L2 INED AT DATUM F. A3 6. A1 IS DEFINED AS THE VERTICAL DISTANCE SEATING L C PLANE FROM THE SEATING PLANE TO THE LOWEST 0.20 C 10X b POINT ON THE PACKAGE BODY. DETAIL A B 2X 5 TIPS M MILLIMETERS 0.25 C A-B D DIM MIN MAX TOP VIEW A 1.25 1.75 A1 0.10 0.25 10X A3 0.17 0.25 h b 0.31 0.51 X 45 0.10 C 0.10 C D 4.80 5.00 E 3.80 4.00 M e 1.00 BSC H 5.80 6.20 h 0.37 REF A L 0.40 1.27 DETAIL A e A1 SEATING L2 0.25 BSC C PLANE M 0 8 END VIEW SIDE VIEW GENERIC RECOMMENDED MARKING DIAGRAM* SOLDERING FOOTPRINT* 10 1.00 10X 0.58 XXXXX PITCH ALYWX 1 XXXXX = Specific Device Code 6.50 A = Assembly Location L = Wafer Lot Y = Year W = Work Week = PbFree Package 1 10X 1.18 DIMENSION: MILLIMETERS *This information is generic. Please refer to device data sheet for actual part *For additional information on our PbFree strategy and soldering marking. PbFree indicator, G, may details, please download the ON Semiconductor Soldering and or not be present. Mounting Techniques Reference Manual, SOLDERRM/D. No.A2038-2/11

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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