Product Information

HBL1025T1G

HBL1025T1G electronic component of ON Semiconductor

Datasheet
ON Semiconductor LED Protection Devices TSPD GEN II 8-16V TSOP-5

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.6493 ea
Line Total: USD 0.65

2910 - Global Stock
Ships to you between
Wed. 01 May to Fri. 03 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2910 - Global Stock


Ships to you between Wed. 01 May to Fri. 03 May

MOQ : 1
Multiples : 1

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HBL1025T1G
ON Semiconductor

1 : USD 0.5359
10 : USD 0.4576
100 : USD 0.2987
500 : USD 0.24
1000 : USD 0.205
3000 : USD 0.1704
9000 : USD 0.1644
24000 : USD 0.1632
45000 : USD 0.1572

     
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RoHS - XON
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HBL1015, HBL1025 Series LED Shunt The HBL1015/25 Series are electronic shunts which provide a current bypass in the case of LEDs going into open circuit. LEDs are by nature quite fragile when subjected to transients and surge conditions. There are also many cases where high reliability of the LED lighting must be maintained such as in headlights, lighthouses, bridges, aircraft, www.onsemi.com runways and so forth. In these cases the low cost addition of the HBL device will provide full assurance that an entire string of LEDs will not extinguish should one LED fail open. The HBL device is also Anode applicable to other loads where circuit continuity is required. The devices can be used with LED string currents from 140 to 500 mA. Control Circuit Features A Bidirectional Device Automatically Resets Itself if the LED Heals Itself or is Replaced Cathode ONState Voltage Typically 1.8 V OFFState Current less than 0.5 A These are PbFree Devices 5 Typical Applications 1 LEDs where Preventive Maintenance is Impractical TSOP5 CASE 483 LED Headlights LEDs with High Reliability Requirements Crowbar Protection for Open Circuit Conditions MARKING DIAGRAM Overvoltage Protection for Sensitive Circuits 5 xxx M 1 xxx = Specific Device Code (015 or 025) M = Date Code = PbFree Package (Note: Microdot may be in either location) 1. Device is bidirectional. Either configuration shown is acceptable. 2. Pin 2 must be electrically floating Figure 1. Pin Connections ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: June, 2015 Rev. 4 HBL1015/DHBL1015, HBL1025 Series MAXIMUM RATINGS Rating Symbol Value Unit OnState Current, (T = 25C) I mA A T(AVG) (Note 1) 500 (Note 2) 425 (Note 3) 250 Thermal Resistance, JunctiontoAir C/W JA (Note 1) 140 (Note 2) 150 (Note 3) 255 Operating Temperature Range T 40 to 150 C J NonOperating Temperature Range T 150 C J Lead Temperature, Soldering (10 Sec) T 260 C L Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2 1. Mounted onto a 1500 mm , Denka K1, 1.5 mm AI, 2 kV thermally conductive dielectric, 2 oz. Cu, or equivalent board. Heat sinking should be spread equally among all pins (caution: pin 2 must be electrically isolated). 2 2. Mounted onto a 2layer, 1000 mm per layer, 3 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must be electrically isolated). 2 3. Mounted onto a 2layer, 50 mm per layer, 1 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must be electrically isolated). NOTE: Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the HBL shunt would now dissipate the power using the same copper heat sink. Since the HBL has a voltage that is lower than that of the LED(s), then the power dissipation would be easily handled by the same heat sink as the LED. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: T = 25C) A Symbol Characteristics Min Min Typ Max Unit V Breakdown Voltage: The minimum voltage across the device in or at HBL1015 8.0 V (BR) the breakdown region. Measured at I = 1 mA. BR HBL1025 11.5 I Holding Current: The minimum current required to maintain the de- HBL1015 125 mA H vice in the on-state. HBL1025 125 V Breakover Voltage: The voltage across the device in the breakover V HBL1015 14.0 BO region. Measured at I = 10 mA. BO HBL1025 16.0 I OffState Current: The dc value of current that results from the ap- HBL1015 0.5 A R plication of the off-state voltage. This is measured at 8.0 V for HBL1025 0.5 HBL1015 and 11.5 V for HBL1025. V OnState Voltage HBL1015 1.2 1.8 2.4 V T HBL1025 1.2 1.8 2.4 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2

Tariff Desc

8541.40.00 54 No .Light emitting diodes (LED), LED displays, optocouplers, photosensitive transistors and diodes, infra-red and fibre optic emitters and detectors Free

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES (LED); MOUNTED PIEZO-ELECTRIC CRYSTALS:
Aptina / ON Semiconductor
FAIRCHILD
FAIRCHILD (ON SEMICONDUCTOR)
Fairchild Semiconductor
FS8
FSC
ON
ON SEMI
ON Semicon
ON SEMICONDUCTOR
ON SEMICONDUCTOR (FAIRCHILD)
ON Semiconductor / Fairchild
ON4
ON5
onsemi
ON-SEMI
onsemi / Fairchild
OOF
Xsens / Fairchild

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