Product Information

XC7SH125GM

XC7SH125GM electronic component of NXP

Datasheet
IC, BUFFER/LINE DRIVER, 3-ST, XSON6

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.1096 ea
Line Total: USD 0.1096

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 05 Apr to Thu. 11 Apr

MOQ : 1
Multiples : 1
1 : USD 0.1096

     
Manufacturer
Product Category
Logic Device Type
Logic Case Style
No Of Pins
Supply Voltage Min
Supply Voltage Max
Operating Temperature Min
Operating Temperature Max
Packaging
Msl
Svhc
Operating Temperature Range
Supply Voltage Range
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AN10343 MicroPak soldering information Rev. 2 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packagesAN10343 NXP Semiconductors MicroPak soldering information Revision history Rev Date Description v.2 20101230 text and graphics updated to latest standards Contact information For more information, please visit:

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