Product Information

T1022NXN7PQB

T1022NXN7PQB electronic component of NXP

Datasheet
Microprocessors - MPU QorIQ, 2x e5500, 1400MHz, DDR3L/4, No Crypto, No Switch, -40 to 105

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

60: USD 122.535 ea
Line Total: USD 7352.1

0 - Global Stock
MOQ: 60  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 60
Multiples : 60
60 : USD 160.8715

0 - Global Stock


Ships to you between Wed. 10 Apr to Fri. 12 Apr

MOQ : 1
Multiples : 1
1 : USD 183.2295

     
Manufacturer
Product Category
Core
Data Bus Width
Maximum Clock Frequency
Interface Type
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Number of Cores
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Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
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Maximum Operating Temperature
Packaging
Memory Type
Brand
I/O Voltage
L2 Cache Instruction / Data Memory
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Document Number T1042 Freescale Semiconductor Rev. 2, 06/2015 Data Sheet: Technical Data T1042 QorIQ T1042, T1022 Data Sheet Features Additional peripheral interfaces Two high-speed USB 2.0 controllers with integrated e5500 cores built on Power Architecture technology, PHY T1042 has four cores and T1022 has two cores Enhanced secure digital host controller with support Each core with a private 256KB L2 cache for high capacity memory card(SD/eSDHC/eMMC) 256 KB shared L3 CoreNet platform cache (CPC) Enhanced Serial peripheral interface (eSPI) Four I2C controllers Hierarchical interconnect fabric Two DUARTs CoreNet Coherency manager supporting coherent Integrated flash controller supporting NAND and and non-coherent transactions with prioritization and NOR flash bandwidth allocation amongst CoreNet end-points Display interface unit (DIU) with 12-bit dual data 150Gbps coherent read bandwidth rate One 32-/64-bit DDR3L/DDR4 SDRAM memory TDM Interface controllers Four GPIO controllers supporting up to 109 general ECC and interleaving support purpose I/O signals Two 8-channel DMA engines Data Path Acceleration Architecture (DPAA) Multicore programmable interrupt controller (MPIC) incorporating acceleration for the following functions: Packet parsing, classification, and distribution QUICC Engine block Queue management for scheduling, packet 32-bit RISC controller for flexible support of the sequencing, and congestion management communications peripherals Hardware buffer management for buffer allocation Serial DMA channel for receive and transmit on all and de-allocation serial channels Cryptography Acceleration Two universal communication controllers, RegEx Pattern Matching Acceleration supporting TDM, HDLC and UART IEEE Std 1588 support 780 FC-PBGA package, 23 mm x 23 mm Parallel Ethernet interfaces Up to two RGMII interface One MII interface Eight SerDes lanes for high-speed peripheral interfaces Four PCI Express 2.0 controllers Two Serial ATA (SATA 3Gb/s) controllers Up to five SGMII interface supporting 1000 Mbps Up to two SGMII interface with maximum speed of 2500 Mbps Supports 1000Base-KX 2015 Freescale Semiconductor, Inc.Table of Contents 1 Overview.............................................................................................. 3 3.18 I2C interface.............................................................................. 127 2 Pin assignments.................................................................................... 4 3.19 GPIO interface...........................................................................131 2.1 780 ball layout diagrams........................................................... 4 3.20 Display interface unit................................................................ 133 2.2 Pinout list...................................................................................10 3.21 TDM interface........................................................................... 135 3 Electrical characteristics.......................................................................46 3.22 High-speed serial interfaces (HSSI).......................................... 137 3.1 Overall DC electrical characteristics.........................................46 4 Hardware design considerations...........................................................160 3.2 Power sequencing......................................................................53 4.1 System clocking........................................................................ 160 3.3 Power-down requirements.........................................................56 4.2 Power supply design..................................................................170 3.4 Power-on ramp rate................................................................... 57 4.3 Decoupling recommendations...................................................175 3.5 Power characteristics.................................................................57 4.4 SerDes block power supply decoupling recommendations.......175 3.6 Input clocks............................................................................... 61 4.5 Connection recommendations................................................... 176 3.7 RESET initialization..................................................................67 4.6 Thermal......................................................................................187 3.8 DDR4 and DDR3L SDRAM controller.................................... 68 4.7 Recommended thermal model...................................................188 3.9 eSPI interface.............................................................................75 4.8 Temperature diode.....................................................................188 3.10 DUART interface...................................................................... 78 4.9 Thermal management information............................................ 189 3.11 Ethernet interface, Ethernet management interface, IEEE Std 5 Package information.............................................................................192 1588........................................................................................... 80 5.1 Package parameters for the FC-PBGA......................................192 3.12 QUICC Engine Specifications...................................................99 5.2 Mechanical dimensions of the FC-PBGA................................. 192 3.13 USB interface............................................................................ 104 6 Security fuse processor.........................................................................194 3.14 Integrated flash controller..........................................................105 7 Ordering information............................................................................194 3.15 Enhanced secure digital host controller (eSDHC).....................113 7.1 Part numbering nomenclature....................................................194 3.16 Multicore programmable interrupt controller (MPIC).............. 122 7.2 Part marking.............................................................................. 195 3.17 JTAG controller.........................................................................124 8 Revision history....................................................................................196 QorIQ T1042, T1022 Data Sheet, Rev. 2, 06/2015 2 Freescale Semiconductor, Inc.

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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