Product Information

SPC5742PFK1AMLQ9

SPC5742PFK1AMLQ9 electronic component of NXP

Datasheet
32-bit Microcontrollers - MCU 1.5MB NVM, 2 x e200Z4 cores, 200MHz, 192K SRAM, 4 x ADC, 2 x PWM, 2 x SENT

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.03 ea
Line Total: USD 10.03

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1
1 : USD 25.9511
10 : USD 21.42

     
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RoHS - XON
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Qualification
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Document Number MPC5744P NXP Semiconductors Rev. 6.1, 11/2017 Data Sheet: Technical Data MPC5744P MPC5744P Data Sheet 32-bit MCU suitable for ISO26262 ASIL- D chassis and safety applications Features This document provides electrical specifications, pin assignments, and package diagram information for the The MPC5744P microcontroller is based on the Power MPC5744P series of microcontroller units (MCUs). Architecture developed by NXP. It targets chassis For functional characteristics and the programming and safety applications and other applications requiring model, see the MPC5744P Reference Manual. a high Automotive Safety Integrity Level (ASIL). The MPC5744P is a SafeAssure solution. Junction temperature: The upper limit is 150C or 165C depending on the device marking. NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction.......................................................................................... 3 3.12 Main oscillator electrical characteristics................................... 69 1.1 Features......................................................................................3 3.13 PLLDIG electrical characteristics............................................. 72 1.2 Block Diagram...........................................................................5 3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical 2 Pinouts..................................................................................................6 specifications............................................................................. 73 2.1 Package pinouts and ballmap.................................................... 6 3.15 ADC electrical characteristics................................................... 74 2.2 Pin/ball descriptions ................................................................. 8 3.16 Flash memory specifications..................................................... 77 2.2.1 Pin/ball startup and reset states................................. 8 3.16.1 Maximum junction temperature 150C.....................77 2.2.2 Power supply and reference voltage pins/balls......... 9 3.16.2 Maximum junction temperature 165C.....................80 2.2.3 System pins/balls.......................................................12 3.16.3 Flash memory read wait-state and address-pipeline 2.2.4 LVDS pins/balls........................................................13 control settings.......................................................... 84 2.2.5 Generic pins/balls......................................................14 3.17 SGEN electrical characteristics................................................. 85 2.2.6 Peripheral input muxing............................................43 3.18 RESET sequence duration.........................................................86 3 Electrical characteristics.......................................................................55 3.19 AC specifications.......................................................................86 3.1 Introduction............................................................................... 55 3.19.1 Reset pad (EXT POR, RESET) electrical 3.2 165C junction temperature option........................................... 55 characteristics............................................................87 3.3 Absolute maximum ratings....................................................... 55 3.19.2 WKUP/NMI timing...................................................89 3.4 Recommended operating conditions......................................... 57 3.19.3 Debug/JTAG/Nexus/Aurora timing..........................89 3.5 Thermal characteristics..............................................................58 3.19.4 External interrupt timing (IRQ pin).......................... 96 3.5.1 General notes for specifications at maximum 3.19.5 SPI timing................................................................. 97 junction temperature................................................. 59 3.19.6 LFAST...................................................................... 102 3.6 Electromagnetic compatibility (EMC)...................................... 60 3.19.7 FlexRay..................................................................... 106 3.7 Electrostatic discharge (ESD) characteristics............................62 3.19.8 Ethernet switching specifications..............................109 3.8 Voltage regulator electrical characteristics............................... 62 4 Obtaining package dimensions.............................................................111 3.9 DC electrical characteristics......................................................65 5 Ordering information............................................................................112 3.10 Supply current characteristics....................................................67 6 Document revision history................................................................... 113 3.11 Temperature sensor................................................................... 69 MPC5744P Data Sheet, Rev. 6.1, 11/2017 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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