Product Information

SPC5644CF0VLU8

SPC5644CF0VLU8 electronic component of NXP

Datasheet
32-bit Microcontrollers - MCU 1.5MB Flash 80MHz -40/+105degC QFP 176

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 34.8158 ea
Line Total: USD 34.82

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Mon. 06 May to Wed. 08 May

MOQ : 200
Multiples : 200
200 : USD 30.5785
600 : USD 29.5205

     
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Freescale Semiconductor Document Number: MPC5646C Rev.6, 02/2014 Data Sheet: Advance Information MPC5646C MAPBGA225 QFN12 208-pin LQFP 256 MAPBGA 15 mm x 15 mm mm x mm (28 mm x 28 mm) (17 mm x 17 mm) MPC5646C SOT-343R PKG-TBD mm x mm mm x mm 176-pin LQFP TBD Microcontroller Data Sheet (24 mm x 24 mm) On-chip modules available within the family e200z4d, e200z0h, or both. include the following features: Crossbar switch architecture for concurrent access to peripherals, flash memory, and e200z4d dual issue, 32-bit core Power SRAM from multiple bus masters Architecture compliant CPU 32 channel eDMA controller with Up to 120 MHz DMAMUX 4 KB, 2/4-Way Set Associative Timer supports input/output channels Instruction Cache providing 16-bit input capture, output Variable length encoding (VLE) compare, and PWM functions (eMIOS) Embedded floating-point (FPU) unit 2 analog-to-digital converters (ADC): one Supports Nexus3+ 10-bit and one 12-bit e200z0h single issue, 32-bit core Power Cross Trigger Unit (CTU) to enable Architecture compliant CPU synchronization of ADC conversions with a Up to 80 MHz timer event from the eMIOS or from the PIT Variable length encoding (VLE) Up to 8 serial peripheral interface (DSPI) modules Supports Nexus3+ Up to 10 serial communication interface Up to 3 MB on-chip flash memory: flash (LINFlex) modules page buffers to improve access time Up to 6 full CAN (FlexCAN) modules with Up to 256 KB on-chip SRAM 64 MBs each 64 KB on-chip data flash memory to CAN Sampler to catch ID of CAN message support EEPROM emulation 2 1 inter IC communication interface (I C) Up to 16 semaphores across all slave ports module User selectable MBIST Up to 177 (LQFP) or 199 (BGA) Low-power modes supported: STOP, configurable general purpose I/O pins HALT, STANDBY 1 System Timer Module (STM) with four 16 region Memory Protection Unit (MPU) 32-bit compare channels Dual-core Interrupt Controller (INTC). Up to 8 periodic interrupt timers (PIT) with Interrupt sources can be routed to 32-bit counter resolution This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Freescale Semiconductor, Inc., 2009-2014. All rights reserved.Table of Contents Introduction 4 problems 66 1.1 Document Overview 4 4.11.2 Electromagnetic interference (EMI) . 67 1.2 Description .4 4.11.3 Absolute maximum ratings (electrical sensitivity)67 2 Block diagram 7 4.12 Fast external crystal oscillator (440 MHz) electrical 3 Package pinouts and signal descriptions 10 characteristics . 68 3.1 Pad types .13 4.13 Slow external crystal oscillator (32 kHz) electrical 3.2 System pins .14 characteristics . 71 3.3 Functional ports 14 4.14 FMPLL electrical characteristics . 73 4 Electrical Characteristics 41 4.15 Fast internal RC oscillator (16 MHz) electrical 4.1 Parameter classification 41 characteristics . 74 4.2 NVUSRO register .41 4.16 Slow internal RC oscillator (128 kHz) electrical 4.2.1 NVUSRO PAD3V5V(0) field description .42 characteristics . 75 4.2.2 NVUSRO PAD3V5V(1) field description .42 4.17 ADC electrical characteristics . 76 4.3 Absolute maximum ratings 42 4.17.1 Introduction . 76 4.4 Recommended operating conditions 44 4.18 Fast Ethernet Controller . 87 4.5 Thermal characteristics .47 4.18.1 MII Receive Signal Timing (RXD 3:0 , RX DV, 4.5.1 Package thermal characteristics 47 RX ER, and RX CLK) . 87 4.5.2 Power considerations .48 4.18.2 MII Transmit Signal Timing (TXD 3:0 , TX EN, 4.6 I/O pad electrical characteristics 48 TX ER, TX CLK) . 87 4.6.1 I/O pad types .48 4.18.3 MII Async Inputs Signal Timing (CRS and COL)88 4.6.2 I/O input DC characteristics 49 4.18.4 MII Serial Management Channel Timing (MDIO and 4.6.3 I/O output DC characteristics .50 MDC)89 4.6.4 Output pin transition times .52 4.19 On-chip peripherals . 91 4.6.5 I/O pad current specification .53 4.19.1 Current consumption 91 4.7 RESET electrical characteristics 55 4.19.2 DSPI characteristics . 93 4.8 Power management electrical characteristics 57 4.19.3 Nexus characteristics . 101 4.8.1 Voltage regulator electrical characteristics 57 4.19.4 JTAG characteristics 103 4.8.2 VDD BV options 59 5 Package characteristics 105 4.8.3 Voltage monitor electrical characteristics 60 5.1 Package mechanical data . 105 4.9 Low voltage domain power consumption .61 5.1.1 176 LQFP package mechanical drawing 105 4.10 Flash memory electrical characteristics 63 5.1.2 208 LQFP package mechanical drawing 108 4.10.1 Program/Erase characteristics 63 5.1.3 256 MAPBGA package mechanical drawing . 113 4.10.2 Flash memory power supply DC characteristics65 6 Ordering information 115 4.10.3 Flash memory start-up/switch-off timings .66 7 Revision history 116 4.11 Electromagnetic compatibility (EMC) characteristics 66 4.11.1 Designing hardened software to avoid noise MPC5646C Data Sheet, Rev.6 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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